Automatic classification package method and system of semiconductor device

Abstract

The invention discloses an automatic classification package method of a semiconductor device. Traceability information of the semiconductor device comprises batch, coordinate and classification information. According to the automatic classification package method, the semiconductor device is packaged on a processing station of an assembly line, and a plurality of semiconductor devices are arrangedon a carrier in an array mode. The automatic classification package method at least comprises the following steps of building communication; updating information; downloading updated traceability information of the semiconductor device from a production line management server by a subsequent production line station machine, wherein the semiconductor device with designed classification informationis only processed by the subsequent production line station machine according to the arrangement of the production line management server. By the automatic classification package method, the technical effects of improving product quality and the machine efficiency, saving resources and energy sources and reducing cost are achieved.

Description

technical field [0001] The present invention relates to the technical field (H01L21 / 66) of testing methods or equipment in the process of manufacturing or processing semiconductor devices, and in particular, the present invention relates to an automatic hierarchical packaging method and system for semiconductor devices. Background technique [0002] At present, in the packaging process, the yield rate of each station cannot be maintained at 100% all the time, and some defective products will be produced. For defective products, the usual method is to use visual inspection at the current station Manually pick them out, or mark the defective products with a marker pen, and manually pick out all the defects together after the final station of packaging is completed. There are two obvious disadvantages in this kind of operation: [0003] A) The process of manual operation may come into contact with other good products, but the operator himself is not aware of it, which causes th...

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Problems solved by technology

[0002] At present, in the packaging process, the yield rate of each station cannot be maintained at 100% all the time, and some defective products will be produced. For defective products, the usual method is to use visual inspection at the current station Manually pick them out, or mark the defective products with a marker pen, and manually pick out all the defects together after the final station of packaging is completed. There are two obvious disadvantages in this kind of operation:

However, the monitoring and marking methods disclosed in these patent documents do not involve improving chip packaging productivity

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