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Semiconductor package having discrete antenna device

A semiconductor and chip packaging technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of different substrate layer design requirements, achieve low packaging cost, short lead time, and good design flexibility sexual effect

Inactive Publication Date: 2019-03-08
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Unfortunately, the design requirements for the substrate layer are very different between antenna and routing

Method used

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  • Semiconductor package having discrete antenna device
  • Semiconductor package having discrete antenna device
  • Semiconductor package having discrete antenna device

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Embodiment Construction

[0015] Specific terms are used throughout the specification and the following claims to refer to specific components. Manufacturers may refer to components by different names, as those skilled in the art will recognize. This document does not intend to distinguish between those components that have different names but have the same function. In the following description and claims, the terms "comprising" and "comprising" are used in an open-ended category and should therefore be construed to mean "including, but not limited to...". Also, the term "coupled" is intended to mean an indirect or direct electrical connection. Thus, if a device couples to another device, that connection may be a direct electrical connection or an indirect electrical connection via other devices and connections.

[0016] The following description is of the best contemplated mode of carrying out the invention. This description is intended to illustrate the general principles of the invention and not...

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Abstract

The present disclosure provides a semiconductor package including a bottom chip package (10) having a first side (10a) and a second side (10b) opposing the first side (10a). The bottom chip package (10) further includes a semiconductor chip (30). A top antenna package (20) mounted on the first side (10a) of the bottom chip package (10) and provided with a first radiative antenna component. In thisway, the bottom chip package and the first top antenna package are separated, and the bottom chip package and the first top antenna package can be separately designed to meet different functions andrequirements, thereby being compatible with design requirements of the antenna and the wiring; on the bottom chip package, denser wiring can be performed to achieve the interconnect function; meanwhile, the wiring on the first top antenna package can be arranged more evenly, so that low packaging cost is achieved, and short preposition time and great design flexibility are also achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor package. Background technique [0002] As is known in the art, shorter interconnects between chips and antennas are increasingly critical in millimeter-wave (mmW) applications. In order to achieve shorter interconnections between chips and antennas, smaller volumes and higher integration of semiconductor packages, a package containing an integrated circuit (IC) chip and an antenna has been developed in the field of semiconductor chip packaging. Antenna package (AiP, Antenna in Package). [0003] Unfortunately, the design requirements on the substrate layer are very different between antennas and wiring. Typically, thin build-up layers are typically required in the substrate layers in order to achieve thin vias and dense interconnects. However, this requirement contradicts that of antenna designs, which typically require thick, almost uniformly distribute...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01L23/482
CPCH01L23/4824H01L23/66H01L2223/6677H01L2223/6616H01L2224/04105H01L2224/12105H01L2224/13144H01L2224/13147H01L2224/16227H01L2224/48227H01L2225/1023H01L2225/1035H01L2225/1058H01L2924/15192H01L2924/15311H01L2924/15321H01L24/20H01L24/16H01L2224/16235H01L2924/15331H01Q1/2283H01L23/5389H01L23/49816H01L23/5384H01Q21/06H01L23/49822H01L23/49827H01L2224/16141H01L2924/1421H01L2924/19042H01L2924/19106
Inventor 韩府义周哲雅郭哲宏吴文洲陈南诚
Owner MEDIATEK INC
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