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Laser cutting device and focusing method and system thereof

A technology of laser cutting and laser cutting head, used in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of poor versatility, poor focusing accuracy, and slow focusing speed.

Active Publication Date: 2019-03-19
HANS LASER TECH IND GRP CO LTD +1
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Problems solved by technology

[0004] The object of the present invention is to provide a laser cutting device and its focusing method and focusing system, so as to solve the problems of poor versatility, poor focusing accuracy, slow focusing speed, cumbersome operation and difficult maintenance in the prior art. technical issues

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  • Laser cutting device and focusing method and system thereof
  • Laser cutting device and focusing method and system thereof
  • Laser cutting device and focusing method and system thereof

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specific Embodiment approach

[0091] Furthermore, please also refer to Figure 1 to Figure 3 , as a specific implementation of the focusing method of the laser cutting device provided by the present invention, the step S100 includes:

[0092] S101, after the laser cutting device is powered on, when receiving the focus return-to-zero signal sent by the numerical control module, control the focus mirror 3 to move to the absolute zero position at a first speed through the servo motor 7, and detect Whether to receive the zero point sensing signal fed back by the mechanical zero point sensing device 10 of the absolute zero point position.

[0093] That is, in this embodiment, after the laser cutting device is powered on, the focusing system 9 will wait to receive the focus return-to-zero signal sent by the numerical control module. , first output the pulse control signal to control the servo motor 7 (the servo motor 7 drives the focusing mirror 3) to move towards the zero point sensing device (that is, the abs...

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Abstract

The invention provides a laser cutting device and a focusing method and system thereof. The focusing method comprises the steps that after the laser cutting device is powered on, a focusing mirror iscontrolled to return to the absolute zero point position when a focusing zero returning signal is received; when a first focus adjusting signal is received, a first analog voltage input signal containing a first target focus position is read and subjected to preset signal treatment, and the output frequency and the pulse quantity of a first pulse control signal for driving a servo motor are determined according to the first target focus position; the first pulse control signal is output according to the determined output frequency and the determined pulse quantity, the servo motor is driven through the first pulse control signal so that the servo motor can drive the focusing mirror to move within the preset motion range, and accordingly, the focus position is adjusted to the first target focus position when a laser cutting head of the laser cutting device conducts focusing on a laser beam. According to the laser cutting device and the focusing method and system thereof, the focusing precision and the focusing speed are improved, in addition, operation is easy and convenient, and the universality is high.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, and more specifically relates to a laser cutting device, a focusing method and a focusing system thereof. Background technique [0002] In the field of plate cutting and processing, laser cutting is widely used due to its advantages of high speed, high precision, and high quality. Its cutting section is smooth and burr-free, which saves many secondary processing links. However, in order to achieve an excellent cutting effect in laser cutting, it is necessary to adjust the laser focus position to a suitable position, which is a very important laser cutting process parameter. However, the laser focus position is not fixed. For plates of different materials, different thicknesses, and different cutting stages, it is necessary to adjust the laser focus to different positions. Even during the laser cutting process, it is necessary to dynamically adjust the laser focus position to achieve better ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/046B23K26/38
CPCB23K26/046B23K26/38
Inventor 谢峰粹余锦望封雨鑫陈焱高云峰
Owner HANS LASER TECH IND GRP CO LTD
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