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Metal target binding welding flux and preparation method thereof

A metal target and solder technology, applied in metal processing equipment, welding equipment, welding/cutting media/materials, etc., can solve the problems of poor wetting effect and target binding welding rate of less than 95%, reaching High wettability, short process, simple and easy-to-obtain raw materials

Inactive Publication Date: 2019-03-19
XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used solder is indium, but for metal targets, such as nickel-platinum and tungsten-titanium targets, the infiltration effect of indium on its surface is relatively poor. After ultrasonic coating, the bound welding rate of the bound targets less than 95%

Method used

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Examples

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Effect test

preparation example Construction

[0022] The present invention also proposes a method for preparing metal target binding solder, which includes the following steps.

[0023] S1. Ingredients: by weight tin: silver: copper = 94~95%: 4.99~5.99%: 0.01~0.05% ingredients, mix evenly, put into a vacuum induction furnace.

[0024] S2. Vacuuming: Vacuumize the vacuum induction furnace until the vacuum degree is less than 3×10 -3 Pa, turn off the vacuum pump, pass the protective gas into the vacuum induction furnace to normal pressure, and then evacuate the vacuum induction furnace until the vacuum degree is less than 3×10 -2 Pa, turn off the vacuum pump, and then pass the protective gas to the vacuum induction furnace to 10~50Pa.

[0025] S3. The first stage of heating: Turn on the induction heating, and the vacuum induction furnace heats up to 235~275°C at the first heating rate, and keeps warm for T1 time.

[0026] S4. The second stage of heating: then the vacuum induction furnace is heated to 300-450° C. at the se...

Embodiment 1

[0035] A method for preparing metal target binding solder, which includes the following steps: ingredients: by weight tin: silver: copper = 95%: 4.99%: 0.01% ingredients, mixed evenly, put into a vacuum induction furnace; Preparation: Vacuum the vacuum induction furnace to a vacuum degree of less than 3×10 -3 Pa, turn off the vacuum pump, feed argon until the pressure in the vacuum induction furnace is normal pressure, and then evacuate until the vacuum degree is less than 3×10 -2 Pa, turn off the vacuum pump, and then introduce argon until the pressure in the vacuum induction furnace is 30Pa; the first stage of heating: turn on the induction heating, raise the temperature to 235°C at a heating rate of 30°C / min, and keep it for 3h; the second stage of heating: Then raise the temperature to 450°C at a heating rate of 50°C / min, and keep it warm for 2 hours; out of the furnace: stop heating, lower the temperature to below 30°C, and out of the furnace to obtain qualified tin-silve...

Embodiment 2

[0037] A method for preparing metal target binding solder, which includes the following steps: ingredients: by weight tin: silver: copper = 94.46%: 5.5%: 0.04% ingredients, mixed evenly, put into a vacuum induction furnace; Preparation: Vacuum the vacuum induction furnace until the vacuum degree is less than 3×10 -3 Pa, turn off the vacuum pump, feed argon until the pressure in the vacuum induction furnace is normal pressure, and then evacuate until the vacuum degree is less than 3×10 -2 Pa, turn off the vacuum pump, and then introduce argon until the pressure in the vacuum induction furnace is 10Pa; the first stage of heating: turn on the induction heating, raise the temperature to 265°C at a heating rate of 20°C / min, and keep it for 2.5h; the second stage of heating : Then raise the temperature to 400°C at a heating rate of 35°C / min, and keep it warm for 4 hours; out of the furnace: stop heating, and when the temperature drops below 30°C, out of the furnace to obtain qualifi...

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Abstract

The invention relates to metal target binding welding flux and a preparation method thereof. The preparation method comprises the following steps of S1, preparing, wherein preparing is carried out according to the weight ratio of tin to silver to copper being (94%-95%):(4.99%-5.99%):(0.01%-0.05%), uniform mixing is carried out, and a mixture is placed in a vacuum induction furnace; S2, vacuumizing, wherein the vacuum induction furnace is vacuumized till the vacuum degree is smaller than 3*10<-3> Pa, a vacuum pump is shut down, and then shield gas is introduced into the vacuum induction furnaceto range from 10 Pa to 50 Pa; S3, first-stage heating, wherein induction heating is started, the vacuum induction furnace is warmed at the first warming rate till the temperature ranges from 235 DEGC to 275 DEG C, and heat preservation is carried out by the time T1; S4, second-stage heating, wherein the vacuum induction furnace is warmed at the second warming rate till the temperature ranges from 300 DEG C to 450 DEG C, and heat preservation is carried out by the time T2; and S5, discharging, wherein heating is stopped, when the temperature is reduced to 30 DEG C or below, discharging is carried out, and the welding flux is obtained. The raw materials of the welding flux are simple and easy to obtain, the preparation process is short, the binding welded rate of targets is larger than 95%, and wettability is higher than that of indium.

Description

technical field [0001] The invention relates to the field of target preparation, in particular to a metal target binding solder and a preparation method thereof. Background technique [0002] The target is generally bound to the back plate or back tube by solder. In order to ensure that the target does not fall off during the sputtering process, the binding rate is generally required to be greater than 95%. [0003] In the process of target binding, ultrasonic coating equipment is usually used to apply a layer of solder on the binding surface of the target, so that the solder can fully and evenly penetrate into the target, which is conducive to the bonding of the target. connection effect. [0004] At present, the commonly used solder is indium, but for metal targets, such as nickel-platinum and tungsten-titanium targets, the infiltration effect of indium on its surface is relatively poor. After ultrasonic coating, the bound welding rate of the bound targets Less than 95%....

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 余芳朱刘童培云
Owner XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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