Lens clamp mechanism for automatic coupling and packaging of butterfly-shaped semiconductor laser

Abstract

The invention discloses a lens clamp mechanism for automatic coupling and packaging of a butterfly-shaped semiconductor laser, and relates to the field of automatic coupling and packaging of electronic devices. The lens clamp mechanism comprises a lens clamp position adjusting device and a lens clamp. The lens clamp is fixed to the lens clamp position adjusting device through a clamp adapter plate. The lens clamp is in a T shape wholly, a lens adsorption hole is formed in one end of the lens clamp, an air suction pipe connecting hole is formed in the other end of the lens clamp, and the air suction pipe connecting hole and the lens adsorption hole are communicated inside the lens clamp. By means of an air suction pipe connected to the air suction pipe connecting hole, negative pressure isformed on the lens adsorption hole, and therefore a lens is adsorbed on the clamp. By means of the lens clamp mechanism, the position of the lens clamp can be finely adjusted conveniently, and by means of adjustment of multiple freedom degrees, the lens can be more accurately put in the laser. The lens clamp mechanism is used in cooperation with a material tray mechanism, so that the angle and theposition of the lens are conveniently adjusted.

Description

technical field [0001] The invention relates to the technical field of automatic coupling packaging, in particular to a lens fixture mechanism for automatic coupling packaging of butterfly semiconductor lasers. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoele...

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coupling, etc.

Therefore, how to solve the problems of low fiber coupling accuracy, high packaging cost, and low product qualification rate in the existing technology is the top priority in the development of butterfly semiconductor lasers.

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