Lens clamp mechanism for automatic coupling and packaging of butterfly-shaped semiconductor laser

An automatic coupling, semiconductor technology, applied in installation, optics, instruments, etc., can solve the problems of insufficient optical fiber coupling accuracy, high packaging cost, low optical fiber coupling accuracy, etc., to achieve automatic packaging, low production cost, and simple operation. handy effect

Active Publication Date: 2019-03-22
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coup

Method used

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  • Lens clamp mechanism for automatic coupling and packaging of butterfly-shaped semiconductor laser
  • Lens clamp mechanism for automatic coupling and packaging of butterfly-shaped semiconductor laser
  • Lens clamp mechanism for automatic coupling and packaging of butterfly-shaped semiconductor laser

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Embodiment Construction

[0044] The specific implementation manners of the present invention will be further described below in conjunction with the drawings and examples. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0045] Such as figure 1 , figure 2 and Figure 5 As shown, this embodiment provides a lens fixture mechanism for automatic coupling and packaging of butterfly semiconductor lasers. The lens fixture mechanism 3 includes a lens fixture position adjustment device and a lens fixture 311, and the lens fixture 311 passes through a fixture adapter plate It is fixed on the position adjustment device of the lens holder; the lens holder 311 is T-shaped as a whole, one end of the lens holder 311 is provided with a lens adsorption hole 316, and the other end of the lens holder 311 is provided with a suction pipe connection Holes 315, the suction pipe connection hol...

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Abstract

The invention discloses a lens clamp mechanism for automatic coupling and packaging of a butterfly-shaped semiconductor laser, and relates to the field of automatic coupling and packaging of electronic devices. The lens clamp mechanism comprises a lens clamp position adjusting device and a lens clamp. The lens clamp is fixed to the lens clamp position adjusting device through a clamp adapter plate. The lens clamp is in a T shape wholly, a lens adsorption hole is formed in one end of the lens clamp, an air suction pipe connecting hole is formed in the other end of the lens clamp, and the air suction pipe connecting hole and the lens adsorption hole are communicated inside the lens clamp. By means of an air suction pipe connected to the air suction pipe connecting hole, negative pressure isformed on the lens adsorption hole, and therefore a lens is adsorbed on the clamp. By means of the lens clamp mechanism, the position of the lens clamp can be finely adjusted conveniently, and by means of adjustment of multiple freedom degrees, the lens can be more accurately put in the laser. The lens clamp mechanism is used in cooperation with a material tray mechanism, so that the angle and theposition of the lens are conveniently adjusted.

Description

technical field [0001] The invention relates to the technical field of automatic coupling packaging, in particular to a lens fixture mechanism for automatic coupling packaging of butterfly semiconductor lasers. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoele...

Claims

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Application Information

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IPC IPC(8): G02B7/02B25B11/00
CPCG02B7/023B25B11/00
Inventor 段吉安徐聪彭晋文卢胜强唐佳刘志贤
Owner CENT SOUTH UNIV
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