Packaging structure and method for eliminating internal stress of packaged body after sensor chip packaging

A sensor chip, packaging structure technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electric solid-state devices, etc., can solve the problems of product failure, gold wire easily broken, etc., to extend service life, eliminate stress, guarantee Effects of Stability and Reliability

Pending Publication Date: 2019-03-26
SHANDONG SENSPIL ELECTRONICS TECH
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  • Description
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  • Application Information

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Problems solved by technology

[0002] Packaging structure packaging with sensitive structures generally does not use the traditional IC packaging form, but adopts cavity packaging. This packaging directly exposes the pressure packaging structure in the previously formulated cavity, and the gold wires that serve as circuit connections are directly exposed. In the air, the gold wire is easily broken after being subjected to external vibrations, so that the entire product fails

Method used

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  • Packaging structure and method for eliminating internal stress of packaged body after sensor chip packaging
  • Packaging structure and method for eliminating internal stress of packaged body after sensor chip packaging
  • Packaging structure and method for eliminating internal stress of packaged body after sensor chip packaging

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[0034] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0035] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.

[0036] As introduced in the background, there are deficiencies in the prior art. In order to solve the above tec...

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Abstract

The invention discloses a packaging structure and a method for eliminating the internal stress of a packaged body after sensor chip packaging, thereby solving a problem of wire breaking caused by theinternal stress change of the packaged body in the prior art and reducing the influence on the chip function by the stress problem inside the packaged body. The packaging structure comprises a substrate or a frame, a chip being mounted on the surface of the substrate or frame and being connected with a pin of the substrate or frame by a wire, a first packaging layer covering the surface and the peripheral side of the chip as well as the connection point between the chip and the wire, and a second packaging layer covering the partial outer side of the first packaging layer and the surface of the substrate or frame. The second packaging layer is provided with a cavity structure for exposure of the local region of the chip.

Description

technical field [0001] The invention relates to the field of semiconductor chip packaging, in particular to a packaging structure and a method for solving the internal stress of the packaging body after the sensor chip is packaged. Background technique [0002] Packaging structure packaging with sensitive structures generally does not use the traditional IC packaging form, but adopts cavity packaging. This packaging directly exposes the pressure packaging structure in the cavity specified in the previous stage, and the gold wires that play the role of circuit connection are directly exposed. In the air, the gold wire is easily broken after being subjected to external vibration, so that the entire product fails. [0003] Since the package contains several different materials, various materials have different volume expansion coefficients, especially plastic packaging materials, chip adhesives, and chips. In the harsh external environment, the volume expansion coefficients of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L21/56H01L23/3121H01L2224/8592H01L2224/48247H01L2224/73265H01L2924/181H01L2224/32245H01L2924/1815H01L2924/00012H01L2924/00
Inventor 刘昭麟邢广军
Owner SHANDONG SENSPIL ELECTRONICS TECH
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