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Substrate inspection apparatus and substrate inspection method

A substrate inspection and substrate technology, which is applied in measurement devices, electronic circuit testing, instruments, etc., can solve problems such as the decline of inspection accuracy, and achieve the effect of reducing the variation of inspection accuracy.

Active Publication Date: 2019-04-02
NIDEC-READ CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the inspection accuracy of the wiring pattern formed on the upper surface of the circuit board decreases compared with the inspection accuracy of the wiring pattern formed on the lower surface of the circuit board.

Method used

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  • Substrate inspection apparatus and substrate inspection method
  • Substrate inspection apparatus and substrate inspection method
  • Substrate inspection apparatus and substrate inspection method

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Embodiment Construction

[0110] Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the structure denoted with the same symbol in each figure represents the same structure, and the description is omitted. figure 1 It is a conceptual diagram schematically showing the structure of a substrate inspection apparatus using a substrate inspection method according to an embodiment of the present invention. figure 1 The substrate inspection apparatus 1 shown in is an apparatus for inspecting a circuit pattern formed on a substrate 100 as an example of an inspection target.

[0111] The substrate 100 can be, for example, the following various substrates: packaging substrates or film carriers for semiconductor packaging, printed wiring substrates, glass epoxy substrates, flexible substrates, ceramic multilayer wiring substrates, liquid crystal displays, or electroluminescence (Electro-Luminescence, EL) Display electrode plates such as displays, transparent conducti...

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Abstract

The invention provides a substrate inspection apparatus and a substrate inspection method. A substrate inspection apparatus (1) is a substrate inspection apparatus for inspecting a substrate (100) onwhich wires (P1, P2) adjacent to each other and opposed to each other are formed. The substrate inspection apparatus includes a first probe (Pr) for contacting one end of the wire (P1), a second probe(Pr) for contacting one end of the wire (P2), a capacitance measurement unit (31) for measuring the electrostatic capacitance between the wire (P1) and the wire (P2), as a line capacitance (Cx), anda first determination unit (22) for determining the state of at least one wire of the wire (P1) and the wire (P2).

Description

Technical field [0001] The invention relates to a substrate inspection device and a substrate inspection method for inspecting a substrate. Background technique [0002] Heretofore, a technique has been known in which a circuit board to be inspected is in close contact with the insulating film of a flat electrode with an insulating film pasted on the upper surface to measure the land formed on the upper surface of the circuit board. The capacitance between the electrode and the electrode, and the measured capacitance is compared with the inspection reference data obtained from the good substrate, thereby inspecting the conduction between the pads on the upper surface of the circuit board and the pads on the lower surface of the circuit board. State (for example, refer to Japanese Patent Laid-Open Publication No. 2001-13192). [0003] However, in the above technique, the wiring pattern and the electrode formed on the upper surface of the circuit board face each other with a thickne...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2812G01R31/2836G01R31/2813G01R27/2605G01R31/2808
Inventor 椹木雅也
Owner NIDEC-READ CORPORATION