A computer temperature control device
A temperature control device and computer technology, which is applied in calculation, instrumentation, electrical digital data processing, etc., can solve problems affecting the life of the motherboard and the stability of the computer, and achieve the effects of ingenious structure, good heat conduction effect, and high heat dissipation performance
Active Publication Date: 2019-09-13
邢国政
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Problems solved by technology
However, in the existing computers, there is no structure for cooling the main board, which not only affects the life of the main board, but also affects the working stability of the computer to a certain extent.
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[0021] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.
[0023] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.
[0024] In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...
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The invention discloses a computer temperature control device. The heat dissipation device comprises a case and a heat dissipation mechanism, the heat dissipation mechanism comprises a water tank, a water pump, a first heat dissipation box, a second heat dissipation box and a controller, the first heat dissipation box is respectively connected with the water tank. The water tank, the water pump, the second heat dissipation box and the first heat dissipation boxes are sequentially connected to form a circulating water path. A groove is formed in the outer side of the first heat dissipation box;a heat conducting plate is arranged in the groove; a computer mainboard is mounted on the heat conducting plate of the side cover; the heat conducting plate comprises a hard layer, a heat conductinglayer and a flexible insulating layer, wherein the heat conducting layer is prepared from the following materials in parts by weight: 86 parts of graphene, 5 parts of isocyanate resin, 7 parts of melamine formaldehyde resin, 14 parts of aluminum nitride and 0.2 part of rare earth oxide La2O3. The computer temperature control device is ingenious in structure, water cooling and air cooling are wellcombined, heat dissipation is rapid, the heat dissipation performance is high, and the heat conduction effect of the heat conduction plate is good.
Description
technical field [0001] The invention relates to the field of computer hardware equipment, in particular to a computer temperature control device. Background technique [0002] With the rapid development of the electronic industry, the computer has become an indispensable device in people's office and life. In the busy work, the computer has been in a long-time running state, so it is very important for people to work to keep the computer in a good and sustainable long-term use state. [0003] In existing computers, the CPU is installed on the motherboard. When the CPU is working, it will emit a lot of heat, some of which will be taken away by the fan, and the other part of the heat will be transferred to the motherboard for heat dissipation. However, in existing computers, there is no structure for heat dissipation of the main board, which not only affects the life of the main board, but also affects the working stability of the computer to a certain extent. Contents of ...
Claims
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IPC IPC(8): G06F1/20
Inventor 邢国政谷海红
Owner 邢国政