Fabrication method of printed circuit board
A technology for printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., and can solve problems such as difficult design of positioning holes on the board, deviation of the shape of the circuit board, and difficulty in fixing small-sized circuit boards. Achieve the effects of improving inspection efficiency and accuracy, improving production efficiency and pass rate, and reducing the number of scratches
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0033] Such as Figure 1 to Figure 3 As shown, the preferred embodiment of the present invention, a method of manufacturing a printed circuit board, includes the following processes: material cutting, drilling, copper sinking, pattern transfer, pattern electroplating, film removal, etching, green oil, characters, gold-plated fingers , molding and testing, it is characterized in that, the specific steps of described molding and described testing are as follows:
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