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Image inspection device, production system, image inspection method, program, and storage medium

An image inspection and image technology, applied in the direction of measuring devices, material analysis through optical means, instruments, etc., can solve the problems of high inspection devices, difficult additional costs, and a large number of steps

Active Publication Date: 2019-04-02
WING VISION CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, it is useful to add an inspection device before reflow, which is an earlier step, to provide early feedback to the mounting machine, but the initial setting requires a large number of steps, and it is difficult to add an inspection device that is expensive

Method used

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  • Image inspection device, production system, image inspection method, program, and storage medium
  • Image inspection device, production system, image inspection method, program, and storage medium
  • Image inspection device, production system, image inspection method, program, and storage medium

Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0106] refer to Figure 1 to Figure 9 The image inspection device 1 according to the first embodiment of the present invention will be described.

[0107] First, use Figure 1 ~ Figure 4 A schematic configuration of the image inspection apparatus 1 according to the first embodiment of the present invention will be described. also, figure 1 is an external perspective view of the image inspection device 1 according to the first embodiment of the present invention, figure 2 yes figure 1 perspective view of the image 3 It is an explanatory drawing of the shooting range of cameras 18a-18d, Figure 4 is a block diagram of the image inspection device 1 .

[0108]

[0109] The image inspection apparatus 1 is an apparatus for performing 2D image inspection, and includes an image inspection apparatus main body 10 and a personal computer main body (hereinafter referred to as “PC (Personal Computer, personal computer) main body”) 25 . The main body 10 of the image inspection ap...

no. 2 Embodiment approach

[0159] refer to Figure 10 An image inspection apparatus 1A according to a second embodiment of the present invention will be described. right with Figure 1 to Figure 9 The same symbols are assigned to the common configurations, and descriptions thereof are omitted. also, Figure 10 It is an external view of the image inspection apparatus 1A of the second embodiment.

[0160] The image inspection apparatus 1A of the second embodiment differs from the image inspection apparatus 1 of the first embodiment in that the PC main body 25 is incorporated into the image inspection apparatus main body 10A to be an all in one type. A PC main body 25 is assembled inside the image inspection apparatus main body 10A, and an LCD (Liquid Crystal Display, Liquid Crystal Display) monitor 26A is attached to the upper portion of the image inspection apparatus main body 10A via a monitor arm 57 . In addition, an indicator lamp 13A is provided on the front upper part of the image inspection app...

no. 3 Embodiment approach

[0164] An image inspection apparatus 1B according to a third embodiment of the present invention will be described. right with Figure 1 to Figure 10 The same symbols are assigned to the common configurations, and descriptions thereof are omitted. The image inspection apparatus 1B of the third embodiment differs from the image inspection apparatus 1 of the first embodiment in that the CAD data of the substrate 20 is used when the automatic grid 54 is acquired and / or when the reference image 40R is acquired.

[0165] First, a method of using the CAD data of the substrate 20 in automatic meshing 54 will be described. In the first embodiment, if the automatic grid 54 is selected, the grid of the standard [1] parameter is arranged in the necessary part by the automatic judgment of the system, but in the third embodiment, the PC main body 25 is preliminarily set The CAD data of the substrate 20 is stored, and the system can use the CAD data of the substrate 20 when the system aut...

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Abstract

Provided is an image inspection device having high detection precision with respect to a color image as well as high orthogonality, and in which the computation time for determination processing is short, initial setting is easy, and the cost thereof is low. This image inspection device 1 is characterized by being provided with: an imaging means 18 for capturing an image of an inspection object asa color image 40; a meshing means 31 for dividing the color image 40 into a mesh shape; a pre-processing means 32 for converting the color image 40 into a predetermined grayscale; a reference image storage means; a determination means 34 including template matching for determining a degree of similarity on the basis of a predetermined parameter for each of a plurality of divisions of the mesh shape for a reference image 40R and an inspection image 40T captured by the imaging means 18, the inspection image 40T being divided into a plurality of divisions in a mesh shape by the meshing means 31and the pre-processing means 32 and converted to the predetermined grayscale; and an interface means 30.

Description

technical field [0001] The present invention relates to an image inspection device for inspecting the state of components mounted on a circuit substrate, wiring patterns, solder balls, damage, stains, etc. of a circuit substrate, a production system including the image inspection device, an image inspection device, and a program , and a storage medium storing the program. Background technique [0002] In the mounting inspection of circuit substrates, three-dimensional (3D) image inspection has been widely performed so far. As a mechanism for 3D image inspection, there are, for example, a mechanism that uses laser light, a mechanism that projects moiré light, and a mechanism that takes pictures with a camera from multiple directions, etc., but all initial settings require many steps and require a lot of time for setting labor and time. In addition, due to a slight change in the printing state of the printed substrate or a difference in the batch of the printed substrate, th...

Claims

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Application Information

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IPC IPC(8): G01N21/956
CPCG01N21/956
Inventor 河原盛人
Owner WING VISION CORP
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