Thin wall temperature equalization plate and manufacturing method thereof

Abstract

The invention provides a temperature equalization plate. The temperature equalization plate comprises a pressure resistant shell and a heat transfer working medium, and the shell is composed of an upper base plate (1) and a lower base plate (2); the base plates are provide with working medium tanks (3), capillary cores (4) and reinforcing column modules (5); the upper base plate (1) and the lowerbase plate (2) are welded to form a closed working medium cavity; and the working medium cavity is filled with the heat transfer working medium. A temperature equalization plate manufacturing method includes the steps of reinforcing column distribution calculation, base plate preparation, capillary core preparation, base plate welding, heat transfer working medium filling, filling port clamping sealing and finish machining. According to the temperature equalization plate and the temperature equalization plate manufacturing method, the manufacture of the thin high-heat transfer performance temperature equalization plate is can realized, and great advantages are achieved in the application of the high-power component heat dissipation field with narrow installation space.

Description

technical field [0001] The present invention relates to the field of spacecraft thermal control, in particular to a thin-walled temperature chamber and a manufacturing method thereof, wherein the thin-walled temperature chamber refers to a temperature chamber with a thickness ranging from 4 to 20 mm. Background technique [0002] With the continuous development of spacecraft research and development technology, various high-performance electronic components have been widely used in various systems. This type of electronic components has high power, small size, high heat flux density, and is located in a small space, making thermal control design difficult. In the field of spacecraft thermal control, thin-walled vapor chamber is an ideal thermal control product to solve the heat dissipation problem of such components. [0003] The vapor chamber (or flat heat pipe) technology is a type of heat dissipation technology developed based on the vacuum chamber heat technology (Vapor...

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Problems solved by technology

[0005] However, the application of the above-mentioned traditional vapor chambers in the field of spacecraft thermal control has the problem of insufficient performance, especially the internal pressure bearing capacity and external stress bearing capacity, which often cannot meet the needs. Vapor chambers in the field have high necessity and practical value

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