Shock wave focus excitation device loading high temperature environment and working method thereof

Abstract

The invention relates to a shock wave focus excitation device loading a high temperature environment and a working method thereof, belonging to the technical field of micro-electro-mechanical systems.The device comprises a cylinder, an electric driven two-shaft displacement table, a light heating unit, and a micro-structure excitation unit, wherein the micro-structure excitation unit is providedwith a shock wave focus cavity at a bottom center of a second connection plate, a semi-ellipsoidal cavity is arranged on the upper end surface of the shock wave focus cavity, needle electrodes are respectively sheathed on two opposite side surfaces of the shock wave focus cavity through ceramic tubes, the tip of each needle electrode is nearby the focus in the semi-ellipsoidal cavity, and a distance between tips of the two needle electrodes is 0.5-1.0mm. The light heating unit adopts a shading sheet and a shading plate, so that parallel light emitted by the light heating unit radiates an MEMSmicro-structure alone. The device can heat the overall MEMS micro-structure, guarantees uniform temperature distribution on the micro-structure surface, lowers temperature gradient on the micro-structure surface, and makes tests of micro-structure dynamic characteristic parameters in high temperature much more accurate.

Description

technical field [0001] The invention relates to a shock wave focusing excitation device loaded in a high-temperature environment and a working method thereof, belonging to the technical field of micromechanical electronics. Background technique [0002] Due to the characteristics of low cost, small size, light weight, high integration and high degree of intelligence, MEMS micro devices have been widely used in automobiles, aerospace, information communication, biochemistry, medical treatment, automatic control, consumer goods and national defense. fields have been widely applied. When designing and developing MEMS, because the system function is mainly realized by the micro-displacement and deformation of the microstructure, it is necessary to measure the dynamic performance of the micro-mechanical components, so the mechanical motion parameters of MEMS such as displacement, velocity, amplitude, frequency and vibration mode Accurate measurement has become an important part ...

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Problems solved by technology

When the above-mentioned heat conduction heating method is used to heat the microstructure, since the heat energy is transferred to the microstructure through the microstructure substrate, the temperature field distribution on the microstructure is very uneven, and the temperature on the microstructure far away from the substrate To be lower than the temperature at the proximal end of the substrate, according to the research results of F, Shen et al. in "Thermal effects on coated resonant microcantilevers", when the temperature field distribution on the microstructure is not uniform, test the dynamic characteristics of the microstructure in a high temperature environment The accuracy of the parameters will be greatly reduced

Therefore, the way of using heat conduction to heat the microstructure in the prior art has great disadvantages

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