Semiconductor Die Attach System and Method

Abstract

The invention relates to a semiconductor die attach system and method. A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

Description

technical field [0001] The present application relates to semiconductor dies, and in particular to systems and methods for attaching semiconductor dies to substrates. Background technique [0002] Semiconductor dies are typically attached to substrates such as leadframes, printed circuit boards (PCBs), and the like using die attach pastes such as adhesive pastes, solder pastes, or sinter pastes. For thinner semiconductor dies, it becomes more likely that the die attach paste will creep onto the top side of the die, which can lead to electrical failures. In addition to avoiding this creepage, acceptable wetting between the backside of the die and the substrate is also important. Wetting refers to the flow of die attach material along the x and y horizontal directions of the substrate. The better the wetting, the easier the die attach process and the higher the likelihood of achieving a high level of reliability of the die attach during stress testing. Strong adhesion to th...

AI Technical Summary

Problems solved by technology

However, die attach films are more expensive and have lower thermal and electrical performance than adhesive paste, solder paste and sinter paste

Also, another issue is avoiding empty

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