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Method of controlling mass transfer of Micro-LEDs by using ultrasonic standing waves

An ultrasonic standing wave and ultrasonic technology, which is applied in electrical components, circuits, semiconductor devices, etc., can solve the problems that the distance between the wafers cannot adapt to the target substrate, and the uniformity and consistency of the elastic film are high.

Active Publication Date: 2019-04-16
西安穿越光电科技有限公司
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Problems solved by technology

This solution can realize the expansion and transfer of a large number of wafers at the same time. However, this solution has high requirements for the uniformity of the elastic film, otherwise the distance between the wafers after expansion cannot meet the requirements of the target substrate.

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  • Method of controlling mass transfer of Micro-LEDs by using ultrasonic standing waves
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  • Method of controlling mass transfer of Micro-LEDs by using ultrasonic standing waves

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Embodiment Construction

[0033] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0034] A method of manipulating the mass transfer of Micro-LEDs using ultrasonic standing waves in this embodiment, such as Figure 1-5 As shown, it includes: a transfer substrate 1, a Micro-LED chip 2, an ultrasonic transducer 3, a laser emitter 4, a guide rail 5 and a target substrate 6;

[0035] The transfer substrate is provided with an elastic layer 11, and the Micro-LED chip 2 is disposed on the elastic layer 11 of the transfer substrate 1;

[0036] The ultrasonic transducer 3 emits ultrasonic waves, the ultrasonic transducer includes a radiation end surface 31 and a reflection end surface 32, and the ultrasonic transducer 3 generates a sound pressure node 7 between the radiation end surface 31 and the reflection end surface 32;

[0037] The transfer substrate 1 is arranged above the guide ra...

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Abstract

The invention discloses a method of controlling mass transfer of Micro-LEDs by using ultrasonic standing waves, which includes the following steps: a transfer substrate is moved in order to make Micro-LED wafers needing to be transferred aligned with a laser emitter; the laser emitter emits a laser beam to make the Micro-LED wafers detach from the elastic layer of the transfer substrate and fall into the ultrasonic control range, and sound pressure nodes make the Micro-LED wafers suspended; a radiation end face and a reflection end face move on a guide rail to change the spacing between the Micro-LED wafers; an ultrasonic transducer stops emitting ultrasonic waves, and the Micro-LED wafers fall onto the corresponding positions of a target substrate under the action of gravity; and after surface mounting, the next surface mounting process continues. The method of the invention has the advantages as follows: the transfer efficiency is high; the method is not limited by the surface mounting spacing of the Micro-LEDs on the target substrate; and the yield of Micro-LED wafer packaging is high.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronic technology, in particular to a method for manipulating Micro-LED mass transfer by using ultrasonic standing waves. Background technique [0002] LED (Light Emitting Diode) is a semiconductor electronic component that can emit light. It has the advantages of high energy conversion efficiency, short reaction time, and long service life. It is obtained by forming and arraying, and the size is only 1-10 μm. Due to the advantages of LED display technology, Micro-LED is increasingly used in display occasions, such as: micro projection (virtual reality equipment), small screen display (smart wearable device), medium and large screen display (TV), Large screen display (outdoor display), etc. However, the manufacturing process of ultra-high-resolution Micro-LED displays still restricts the application of Micro-LEDs to the above-mentioned purposes. Compared with OLED (organic light-emitting di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/67
Inventor 陈云施达创陈新刘强高健汪正平
Owner 西安穿越光电科技有限公司
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