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Nano hybrid molecular compound containing multiple silicon hydrogen bonds and phenyl and application thereof

A molecular compound, silicon-hydrogen bond technology, applied in electrical components, circuits, adhesives, etc., can solve the problems of difficult production and instability of POSS, and achieve the effects of high curing efficiency, low TGA loss, and high crosslinking density.

Inactive Publication Date: 2019-04-19
FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, POSS containing multiple Si-H bonds is not easy to fabricate or has the problem of instability at room temperature

Method used

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  • Nano hybrid molecular compound containing multiple silicon hydrogen bonds and phenyl and application thereof
  • Nano hybrid molecular compound containing multiple silicon hydrogen bonds and phenyl and application thereof
  • Nano hybrid molecular compound containing multiple silicon hydrogen bonds and phenyl and application thereof

Examples

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preparation example Construction

[0053] In some more specific embodiments, the preparation method specifically includes: after mixing octavinyloctasilsesquioxane, a compound containing at least two silicon-hydrogen bonds, a catalyst, and an organic solvent, heating to reflux for silicon-hydrogen Addition reaction generates the POSS nano-hybrid molecular compound containing multiple Si-H bonds and phenyl groups. Wherein, the organic solvent can be selected from compounds capable of dissolving octavinyl octasilsesquioxane, containing at least two silicon-hydrogen bonds, but will not dissolve octavinyl octasilsesquioxane, containing at least two A silicon-hydrogen bond compound, an organic solvent for any reaction in the catalyst, such as benzene, toluene and other common organic solvents.

[0054] Further, the conditions of the aforementioned hydrosilylation reaction can refer to literatures such as "Hydrosilylation Reaction and Research" (Journal of Shaoyang Teachers College, No. 2, 1998, p82-84).

[0055] An...

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PUM

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Abstract

The invention discloses a nano hybrid molecular compound containing multiple silicon hydrogen bonds and phenyl, wherein the typical structure is as shown in the specification, the invention further discloses a curable organic silicon composition, the curable organic silicon composition comprises a POSS nano hybrid molecular compound. When the nano hybrid molecular compound containing the multiplesilicon hydrogen bonds and phenyl is applied as a cross-linking agent for hydrosilylation reaction, the nano hybrid molecular compound containing the multiple silicon hydrogen bonds and phenyl has theadvantages of being high in viscosity, high in crosslinking density, high in refractive index and the like compared with existing cross-linking agents, the nano hybrid molecular compound containing the multiple silicon hydrogen bonds and phenyl has higher refractive index, and has the advantages of being easy to operate and apply, higher in reaction activity, higher in crosslinking density and the like due to the fact that the nano hybrid molecular compound containing the multiple silicon hydrogen bonds and phenyl is a liquid, and the organic silicon composition containing the (POSS) nano hybrid molecular compound also has the advantages of high curing efficiency, high hardness and relatively high refractive index after curing, low heat loss and the like, and is suitable for packaging, bonding, surface protection and other fields of various electronic devices, semiconductor photoelectric devices and the like.

Description

technical field [0001] The present invention specifically relates to a nano-hybrid molecular compound containing multiple silicon-hydrogen bonds and phenyl groups, a curable organosilicon composition comprising the nano-hybrid molecular compound containing multiple silicon-hydrogen bonds and phenyl groups, etc., It can be applied to the field of encapsulation of semiconductor devices such as light-emitting diodes (LEDs) and electronic devices. Background technique [0002] LED (Semiconductor Light Emitting Diode) is widely used in lighting, backlighting and other fields due to its advantages of low energy consumption, long life, small size and the like. The packaging process is a very important process in the LED manufacturing process, which has a very significant impact on the performance and cost of the LED. [0003] With the development of semiconductor devices, the performance requirements for packaging adhesives are gradually increasing. For example, as the power and ...

Claims

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Application Information

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IPC IPC(8): C08G77/12C08G77/44C08L83/07C08L83/10C09J183/07H01L23/29
CPCC08G77/12C08G77/44C08G77/80C08L83/04C08L2203/206C08L2205/02C09J183/04H01L23/296C08L83/10
Inventor 张汝志
Owner FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD