Polishing head and chemical mechanical polishing device
A technology of grinding head and limit ring, which is applied in the direction of grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of chemical mechanical grinding damage of grinding pads, achieve the effects of improving quality, reducing production costs, and improving product yield
Inactive Publication Date: 2019-04-30
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology
However, there are often tiny undulations on the limit ring, and these tiny undulations will scratch the polishing pad to varying degrees during the contact process with the polishing pad, causing the polishing pad to cause damage to the chemical mechanical polishing of the subsequent wafer.
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[0026] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.
[0027] For a thorough understanding of the present invention, a detailed description will be provided in the following description to illustrate the polishing head and the chemical mechanical polishing apparatus of the present invention. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.
[0028] It should be note...
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The invention provides a polishing head and a chemical mechanical polishing device. The polishing head includes a limit ring. The bottom of the limit ring is arranged as an inclined plane inclined downward from inside to outside along the radial direction. According to the invention, the bottom of the limit ring is arranged as an inclined plane inclined downward from inside to outside along the radial direction, which effectively reduces the contact between the bottom surface of the limit ring and a polishing pad during chemical mechanical polishing and reduces the scratch damage to the polishing pad caused by small fluctuation of the bottom surface of the limit ring, thereby reducing the impact of the scratch damage of the polishing pad on the chemical mechanical polishing of a semiconductor wafer, improving the quality of the chemical mechanical polishing, effectively improving the product yield rate and reducing the production cost. Meanwhile, the accumulation of polishing by-products at the inner side of the limit ring and an inlet end of a flow guiding groove is reduced, the influence of the polishing by-products on the chemical mechanical polishing is reduced, and the qualityof the chemical mechanical polishing is further improved.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a grinding head and a chemical mechanical grinding device. Background technique [0002] With the reduction of feature size and the increase of metal interconnection in the manufacturing process of integrated circuits, the requirements for the flatness of the wafer surface are getting higher and higher. Chemical mechanical polishing (CMP) is a technology that combines mechanical polishing and chemical etching, and is currently the most effective wafer planarization method. Chemical mechanical polishing uses a rotating polishing head to hold the wafer and press it against a rotating polishing pad with a certain pressure. Through the action of the polishing slurry, the surface of the wafer is flattened under the combined action of chemical and mechanical. [0003] Generally, a polishing device used in the semiconductor field includes a polishing pad and a polishing head ...
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IPC IPC(8): B24B37/00
CPCB24B37/00
Inventor 唐强马智勇
Owner SEMICON MFG INT (SHANGHAI) CORP