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Application of benzopyrazine compound in copper surface roughening and composition for copper surface roughening comprising same

A technology of benzopyrazine and dichlorobenzopyrazine, which is applied in the directions of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of open circuit, thin copper, difficult circuit processing, etc., and achieves small surface area and color. uniform effect

Active Publication Date: 2019-05-03
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, if the traditional copper surface roughening composition is used to treat the copper surface, if a uniform brown-black and honeycomb structure is to be obtained, the amount of copper etching will exceed 1.5 μm, which will cause the remaining copper to be too thin after treatment, which will cause Subsequent circuit processing is difficult, and even defects such as open circuit and circuit deformation appear, which affect the quality of the circuit board
Therefore, the traditional copper surface roughening composition with high micro-etching amount is not suitable for the pretreatment of laser drilling in the preparation of fine circuit manufacturing.

Method used

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  • Application of benzopyrazine compound in copper surface roughening and composition for copper surface roughening comprising same
  • Application of benzopyrazine compound in copper surface roughening and composition for copper surface roughening comprising same
  • Application of benzopyrazine compound in copper surface roughening and composition for copper surface roughening comprising same

Examples

Experimental program
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Effect test

Embodiment 1

[0036] The components of the copper surface roughening composition are: benzopyrazine 5g / L, sulfuric acid 70g / L, hydrogen peroxide 10g / L, benzotriazole 8g / L, hydrochloric acid (concentration is calculated as halide ion) 10ppm .

[0037] Preparation:

[0038] Dissolve the benzotriazole and benzopyrazine of the desired concentration in a certain volume of pure water, then add sulfuric acid, hydrogen peroxide and hydrochloric acid of the desired concentration, stir evenly, and set the volume to 2L to obtain the copper surface of Example 1 Composition for roughening, set aside.

Embodiment 2

[0040] The composition of copper surface roughening composition is: 5-hydroxybenzopyrazine 3g / L, sulfuric acid 110g / L, hydrogen peroxide 12g / L, benzotriazole 12g / L, sodium chloride (concentration according to Halide ion calculation) 20ppm.

[0041] Preparation:

[0042] Dissolve the benzotriazole and 5-hydroxybenzopyrazine of the required concentration in a certain volume of pure water, then add the sulfuric acid, hydrogen peroxide and sodium chloride of the required concentration, stir evenly, and set the volume to 2L to obtain the implementation The copper surface roughening composition of example 2 is for subsequent use.

Embodiment 3

[0044] The components of the copper surface roughening composition are: 5-methylbenzopyrazine 1g / L, sulfuric acid 90g / L, hydrogen peroxide 12g / L, 5-methyl-1-chlorobenzotriazole 11g / L, Potassium chloride (concentration is calculated as halide ion) 15ppm.

[0045] Preparation:

[0046] Dissolve the required concentration of 5-methyl-1-chlorobenzotriazole and 5-methylbenzopyrazine in a certain volume of pure water, then add the required concentration of sulfuric acid, hydrogen peroxide and potassium chloride, and stir Evenly, set the volume to 2L to obtain the composition for roughening the copper surface of Example 3, and set it aside.

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Abstract

The present invention relates to an application of a benzopyrazine compound in copper surface roughening and a composition for copper surface roughening comprising the same. The benzopyrazine compoundhas a structure represented by the formula (I) (shown in the description), wherein R1, R2, R3, R4 and R5 are correspondingly selected from a hydrogen atom, a methyl group, a hydroxyl group, a carboxyl group or a nitro group; and R5 and R6 are correspondingly selected from a hydrogen atom, a carboxyl group or a chlorine atom. The benzopyrazine compound and the copper surface roughening compositioncontaining the same have the advantages of uniformizing color of the copper surface before laser drilling, large specific surface area, low copper layer micro-etching amount, and the quality of a circuit board manufactured by the benzopyrazine compound is effectively improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to the application of benzopyrazine compounds in copper surface roughening and a copper surface roughening composition containing the same. Background technique [0002] With the rapid development of High Density Interconnector (HDI) products and technologies, electronic products are developing towards miniaturization, portability, multi-function, high reliability, high integration and high frequency. The line width / line spacing of HDI products is also continuously shrinking, from the traditional 75 μm / 75 μm or more to 50 μm / 50 μm, 30 μm / 30 μm, and even ultra-fine lines below 10 μm / 10 μm appear in the IC substrate, resulting in the difficulty of product circuit processing. keep climbing. [0003] In the process of processing tiny circuits on HDI boards, blind hole technology is particularly important due to the small area of ​​the board and the need to achieve a hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/00
Inventor 杜小林叶绍明赵明宇万会勇刘彬云
Owner GUANGDONG TONESET SCI & TECH