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Application of benzopyrazine compounds in copper surface roughening and copper surface roughening composition containing the same

A technology of benzopyrazine and composition, applied in the field of circuit board processing, can solve the problems of open circuit, thin copper, difficult circuit processing, etc., and achieve the effect of small surface area and uniform color

Active Publication Date: 2021-02-23
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, if the traditional copper surface roughening composition is used to treat the copper surface, if a uniform brown-black and honeycomb structure is to be obtained, the amount of copper etching will exceed 1.5 μm, which will cause the remaining copper to be too thin after treatment, which will cause Subsequent circuit processing is difficult, and even defects such as open circuit and circuit deformation appear, which affect the quality of the circuit board
Therefore, the traditional copper surface roughening composition with high micro-etching amount is not suitable for the pretreatment of laser drilling in the preparation of fine circuit manufacturing.

Method used

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  • Application of benzopyrazine compounds in copper surface roughening and copper surface roughening composition containing the same
  • Application of benzopyrazine compounds in copper surface roughening and copper surface roughening composition containing the same
  • Application of benzopyrazine compounds in copper surface roughening and copper surface roughening composition containing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]The components of the copper surface roughening composition are: benzopyrazine 5g / L, sulfuric acid 70g / L, hydrogen peroxide 10g / L, benzotriazole 8g / L, hydrochloric acid (concentration calculated as halide ion) 10ppm .

[0037]Preparation:

[0038]Dissolve the required concentration of benzotriazole and benzopyrazine in a certain volume of pure water, then add the required concentration of sulfuric acid, hydrogen peroxide and hydrochloric acid, stir evenly, and dilute to 2L to obtain the copper surface of Example 1. The composition for roughening is ready for use.

Embodiment 2

[0040]The components of the copper surface roughening composition are: 5-hydroxybenzopyrazine 3g / L, sulfuric acid 110g / L, hydrogen peroxide 12g / L, benzotriazole 12g / L, sodium chloride (concentration according to Halide ion calculation) 20ppm.

[0041]Preparation:

[0042]Dissolve the required concentration of benzotriazole and 5-hydroxybenzopyrazine in a certain volume of pure water, then add the required concentration of sulfuric acid, hydrogen peroxide and sodium chloride, stir evenly, and dilute to 2L to get the implementation The composition for roughening the copper surface of Example 2 is reserved.

Embodiment 3

[0044]The components of the copper surface roughening composition are: 5-methylbenzopyrazine 1g / L, sulfuric acid 90g / L, hydrogen peroxide 12g / L, 5-methyl-1-chlorobenzotriazole 11g / L, potassium chloride (concentration calculated as halide ion) 15ppm.

[0045]Preparation:

[0046]Dissolve the required concentration of 5-methyl-1-chlorobenzotriazole and 5-methylbenzopyrazine in a certain volume of pure water, then add the required concentration of sulfuric acid, hydrogen peroxide and potassium chloride, and stir Evenly, the volume was adjusted to 2L, and the copper surface roughening composition of Example 3 was obtained for use.

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Abstract

The present invention relates to the application of benzopyrazine compounds in copper surface roughening and the copper surface roughening composition containing the same. Among them, the benzopyrazine compounds have the structure shown in formula (I) wherein, R 1 , R 2 , R 3 , R 4 and R 5 each independently selected from a hydrogen atom, a methyl group, a hydroxyl group, a carboxyl group or a nitro group; R 5 and R 6 each independently selected from a hydrogen atom, a carboxyl group or a chlorine atom. The above-mentioned benzopyrazine compound and the copper surface roughening composition containing it have the advantages of uniform color of the copper surface before laser drilling, large specific surface area and low amount of microetching of the copper layer, which can effectively improve The quality of the prepared circuit board.

Description

Technical field[0001]The present invention relates to the technical field of circuit board processing, in particular to the application of benzopyrazine compounds in copper surface roughening and a copper surface roughening composition containing the same.Background technique[0002]With the rapid development of High Density Interconnector (HDI) products and technologies, electronic products are developing towards miniaturization, portability, multi-function, high reliability, high integration and high frequency. The line width / line spacing of HDI products has also been shrinking, from the traditional 75μm / 75μm above to 50μm / 50μm, 30μm / 30μm, and even ultra-fine lines below 10μm / 10μm appear in the IC carrier board, which makes it difficult to process product lines. Keep climbing.[0003]In the process of processing tiny circuits on HDI boards, blind hole technology is particularly important due to the small area of ​​the board and the realization of high-level interconnection of any laye...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18H05K3/00
Inventor 杜小林叶绍明赵明宇万会勇刘彬云
Owner GUANGDONG TONESET SCI & TECH