Ultrafast laser rotary-cut processing method for deep micro hole

Abstract

The invention provides an ultrafast laser rotary-cut processing method for a deep micro hole. The ultrafast laser rotary-cut processing method for the deep micro hole comprises the following steps ofusing ultrafast laser for outputting an efficiency mode pulse string and a quality mode pulse string through pulse modulation; calibrating the efficiency mode pulse string and the quality mode pulse string; using the efficiency mode pulse string for roughly processing the deep micro hole through a deflection crystal system; using the quality mode pulse string for finish processing the deep micro hole through the deflection crystal system; and finishing the surface of the deep micro hole through the laser. According to the ultrafast laser rotary-cut processing method for the deep micro hole provided by the invention, the efficiency mode pulse string is utilized for roughly processing, so that a positive-taper deep micro hole can be quickly sized, and the processing efficiency is effectivelyensured; and a head pulse and a conventional pulse of the quality mode pulse string are utilized, the head pulse is used for breaking through a material ablation threshold and roughening the surfaceso as to form a black body, the conventional pulse can be easy to finely process the surface, during the finish processing process, the processing efficiency of the ultrafast laser is maximally played, and meanwhile, the processing quality of the surface of the positive-taper deep micro hole can be further ensured.

Description

technical field [0001] The invention relates to the processing field of deep microholes or the field of laser processing, in particular to an ultrafast laser rotary cutting processing method for deep microholes. Background technique [0002] High-efficiency and high-quality processing of deep micro-holes with a large depth-to-diameter ratio is a worldwide processing problem. Scientists at home and abroad have been trying to overcome it with various methods, including the rapid development of laser micromachining technology in recent years. The principle of laser drilling is to use high-energy laser to irradiate the surface of the material, and the processed material absorbs photon energy to cause gasification, thereby removing the material to achieve drilling. Compared with drilling methods such as EDM and micro-drilling, laser drilling has obvious technical advantages: (1) It can obtain a larger depth-to-diameter ratio; (2) Faster speed, higher efficiency, and better econo...

AI Technical Summary

Problems solved by technology

Although it is also a technology applied to the removal of burrs on the inner wall of the hole, it is only applicable to the removal of burrs on the inner wall of the millimeter-scale pin hole. For the micron-scale deep micro-holes described in the present invention, the introduction of shock waves and the setting of plugs are relatively large problems. At the same time, the equipment cost of the technical solution disclosed in its patent is relatively high, and it needs to cooperate with visual automatic detection and positioning. For deep micro-hole deburring, its process value and significance are not great

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