Method for realizing surface flattening of pit-shaped microarray structural unit by secondary pressing

Abstract

The invention relates to a method for second pressing to realize the surface flattening of a pit-shaped microarray structure unit, which belongs to the mechanical field. The mechanical processing process of the pit-shaped microarray structure unit is simulated, that is, the Vickers indenter is used to press into the surface of the material to form a pit unit with a characteristic size of micron. The phenomenon is accompanied by the existence of residual stress. In order to flatten the surface and reduce the residual stress on the surface, a cube-corner indenter is used to press vertically into the side of the dimple unit with a characteristic size of micron, forming an indentation with a characteristic size of nanometer, and releasing the residual stress stored in the material to achieve The purpose of functional surface planarization. This method provides a surface flattening method for the functional surface of microarray structure manufactured by precision machining technology. The operation is simple, the equipment has rich functions, and can be used for large-scale batch machining.

Description

technical field [0001] The invention relates to the mechanical field, in particular to a method for realizing planarization of the surface of a pit-shaped microarray structure unit by secondary pressing. The surface flattening treatment can be carried out on the surface protrusion phenomenon caused by the action of force during the precision machining process of the pit-shaped micro-array mechanism unit. It can provide a planarization method for surface processing of pit-shaped microarray structural units involved in bionic engineering, aerospace, communication engineering and other fields. Background technique [0002] Microstructure functional surface refers to a type of surface with regularly distributed microscopic geometric topological shapes, and its structure size is generally 10−100 μm. Its microscopic geometry is usually in the form of an array, so it is called a microarray structure. Typical microarray structures include pit-shaped arrays, microlens arrays, pyram...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for second press-in to realize the flattening of the surface of the pit-shaped microarray structure unit, which overcomes the deficiencies of the surface protrusion of the material and the residual stress inside the material caused by the precision machining of the existing microarray structure. Secondary pressing releases the residual stress existing inside the material, making the surface energy tend to be more stable and achieving the purpose of surface flattening

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