A composite rc-ligbt device integrating ldmos and ligbt
A composite type and device technology, applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., can solve the problems of devices not working normally, burning out, excessive local current, etc., and achieve the effect of avoiding the snapback effect
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[0045] Preferred embodiments of the present invention will be described in detail below. For the experimental methods that do not specify specific conditions in the examples, usually follow the conventional conditions or the conditions suggested by the manufacturer.
[0046] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0047] The cross-sectional structure of a composite RC-LIGBT device integrating LDMOS and LIGBT is shown in Figure 6 Shown: From left to right, it is divided into LDMOS area and LIGBT area. In the LDMOS area, metal collector I12, collector N-Collector 11, N-drift region 9, N-buffer I10, gate oxide layer I4, gate I3, N+ electron emitter I2, emitter 1, P- body 6, below is the dielectric isolation layer 16 and the substrate 17; the LIGBT region is set from right to left metal collector II 15, collector P-Collector 14, N-buffer II 13, N-drift region 9, gate oxide layer II 8, ga...
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