Composite RC-LIGBT (Reverse-Conducting Lateral Insulated Gate Bipolar Transistor) device integrated with LDMOS (Laterally Diffused Metal Oxide Semiconductor) and LIGBT (Lateral Insulated Gate Bipolar Transistor)
A composite type and device technology, applied in the field of composite RC-LIGBT devices, can solve problems such as device failure, burnout, and circuit collapse, and achieve the effect of avoiding the snapback effect
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[0045] Preferred embodiments of the present invention will be described in detail below. For the experimental methods that do not specify specific conditions in the examples, usually follow the conventional conditions or the conditions suggested by the manufacturer.
[0046] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0047] The cross-sectional structure of a composite RC-LIGBT device integrating LDMOS and LIGBT is shown in Image 6 Shown: From left to right, it is divided into LDMOS area and LIGBT area. In the LDMOS area, metal collector I12, collector N-Collector11, N-drift region 9, N-buffer I10, gate oxide layer I4, gate I3, N+ electron emitter I2, emitter 1, P-body are set from left to right 6. Below is the dielectric isolation layer 16 and the substrate 17; the LIGBT region is provided with metal collector II 15, collector P-Collector 14, N-buffer II 13, N-drift region 9, gate oxide...
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