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Method for connecting copper-silver alloy by high-temperature alloy ring-shaped member

A high-temperature alloy, copper-silver alloy technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of peeling of the connecting layer, high porosity of the connecting layer, and falling blocks, etc., to enhance the connection strength, avoid peeling, The effect of a reliable connection

Inactive Publication Date: 2019-05-17
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When connecting superalloys and copper-silver alloy materials, traditional welding, brazing, and direct welding methods have problems such as peeling off, falling blocks, delamination, separation from the substrate, and high porosity of the connecting layer.

Method used

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  • Method for connecting copper-silver alloy by high-temperature alloy ring-shaped member
  • Method for connecting copper-silver alloy by high-temperature alloy ring-shaped member
  • Method for connecting copper-silver alloy by high-temperature alloy ring-shaped member

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Embodiment Construction

[0021] The method for connecting the copper-silver alloy with the high-temperature alloy ring provided by the present invention will be described in detail below with reference to the accompanying drawings and specific examples.

[0022] Such as figure 1 — Figure 4 As shown, the method for connecting the copper-silver alloy with the high-temperature alloy ring piece provided by the present invention comprises the following steps carried out in order:

[0023] 1) According to the structural features of the final connecting piece 6, a superalloy ring piece 3 and a copper-silver alloy ring piece 4 are prepared. The material of the superalloy ring 3 can be nickel-based superalloys such as GH4169 and GH600 and iron-based superalloys such as GH2909, and the ratio of copper to silver in the copper-silver alloy material can be changed. In order to ensure the dimensional accuracy of the connecting parts, the connection position of the high-temperature alloy ring part 3 is processed ...

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Abstract

The invention provides a method for connecting a copper-silver alloy by a high-temperature alloy ring-shaped member. The method comprises steps such as preparing the high-temperature alloy and the copper-silver alloy, preparing a wrapping sleeve, assembling, preforming hot isostatic pressure pretreatment, controlling hot isostatic pressing process and post processing. A hot isostatic pressure diffusion and bonding process is adopted by the method, and an interlayer brazing filler metal is used, so that the diffusion bonding is formed by the copper-silver alloy and the high-temperature alloy ring-shaped member under high temperature and high pressure so as to form a connecting member of the high-temperature alloy and the copper-silver alloy. According to the method, a reliable connection ofthe high-temperature alloy and the copper-silver alloy is achieved, a functional integrated structure member is formed, the connection strength is enhanced, and the problems such as peeling and delamination of a connection layer are avoided.

Description

technical field [0001] The invention belongs to the field of manufacturing high-temperature alloy functional structural parts, in particular to the connection between high-temperature alloy ring parts and copper-silver alloys. Background technique [0002] Superalloys have been widely used in aerospace and energy fields. However, with the development of materials and processes, superalloys need to be combined with other materials to achieve functional integration under the condition of satisfying structure and strength. When connecting superalloys and copper-silver alloy materials, traditional welding, brazing, and direct welding methods have problems such as peeling off, falling blocks, delamination, separation from the substrate, and high porosity of the connecting layer. [0003] Hot isostatic pressing technology is a process that applies high temperature and high pressure to the connecting material at the same time, so that the atoms of the connecting material move rapi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B23K31/02
Inventor 郎利辉徐文才
Owner BEIHANG UNIV
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