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Method for disassembling electric device of laser shock assisted microcomputer

A technology of laser shock and electrical devices, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as difficult disassembly, scratches and damage of devices, and achieve the effect of avoiding contact scratches

Inactive Publication Date: 2019-05-21
CHENGDU HAIYI ELECTROMECHANICAL EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the traditional operating process in the disassembly process of micro-electromechanical devices is easy to cause scratch damage to the device and difficult to disassemble at the micro-nano scale, the present invention proposes a laser shock wave-assisted disassembly method for micro-electromechanical devices

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  • Method for disassembling electric device of laser shock assisted microcomputer
  • Method for disassembling electric device of laser shock assisted microcomputer
  • Method for disassembling electric device of laser shock assisted microcomputer

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Embodiment Construction

[0034] The details and working conditions of the specific device proposed by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0035] The MEMS device I2 is attached to the MEMS carrier wafer 4 , and the MEMS device II3 is interference-connected with the MEMS device I2 to form the MEMS 1 .

[0036] Wash the surface of the MEMS device I2 and the MEMS device II3 with alcohol or acetone, pre-coat the absorbing layer 5 on the back of the MEMS device I2 and the MEMS device II3, the thickness of the absorbing layer 5 is 0.1-0.15mm, and there is enough viscosity to make The MEMS 1 will not fall off from the surface of the metallic glass 6; the MEMS 1 is adhered to the surface of the high-strength metallic glass 6 by using the viscosity of the absorbing layer 5, and the metallic glass 6 serves as the carrier for the MEMS 1 and the constraints of the laser shock layer; the metallic glass 6 carrying the micro-electro-mechanical syste...

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Abstract

The invention relates to a disassembly method of a microcomputer electric device, specifically a method for realizing the separation between matched microcomputer electric devices by utilizing the expansion of plasma generated by laser shock and the mechanical effect of shock wave, which is suitable for the disassembly and separation of the microcomputer electric device. By using the mechanical effect of the laser shock wave, the method provided by the invention can realize the disassembly of the microcomputer electric device in the microcomputer electric system through the non-contact force generated by the shock wave, so that the problems of contact scratch and damage of components caused by conventional operation and difficulty in disassembly at the micro-nano scale are avoided, and theimpact pressure of the laser shock wave is fully utilized to eject the microcomputer electric device in the laser radiation direction, so the invnetion is a brand-new disassembling method of the microcomputer electric device.

Description

technical field [0001] The invention relates to a disassembly method of micro-electromechanical devices, in particular to a method for separating mated micro-electro-mechanical devices by utilizing the expansion of plasma generated by laser shock and the mechanical effect of shock waves, and is suitable for disassembly and separation of micro-electro-mechanical devices. . Background technique [0002] MEMS has the characteristics of miniaturization, diversification, and microelectronics, and has advantages that traditional electromechanical systems cannot match. According to the size of the shape, MEMS can be divided into: 1-10mm micro machinery, 1μm-1mm micro Mechanics and 1nm-1μm nanomachines; at the scale that current microelectromechanical systems can achieve, the basic laws of the macroscopic physical world are still in effect, but with the continuous shrinking of devices or structures, the integration level is getting higher and higher, and the macroscopic Interferenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P11/00
Inventor 吴柏强
Owner CHENGDU HAIYI ELECTROMECHANICAL EQUIP CO LTD
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