A method of rounding and grooving crystal ingots using a vertical spheronizing and grooving machine for semiconductor crystal ingots

Abstract

The invention discloses a crystal bar rounding and grooving method by using a semiconductor crystal bar vertical rounding and grooving machine. The method is characterized by comprising the followingsteps: (S1) semiconductor crystal bars are loaded, and are changed to a vertical state; (S2) the semiconductor crystal bars are transferred from a loading platform to a vertical positioning device; (S3) the semiconductor crystal bars are vertically positioned; (S4) the semiconductor crystal bars are transferred to a grinding device for grinding from the vertical positioning device; (S5) the internal crystal orientation analysis is performed on the grinded semiconductor crystal bars; (S6) grooves are cut in the semiconductor crystal bars after the internal crystal orientation analysis; and (S7)the machined semiconductor crystal bars are unloaded. The machining method effectively simplifies the positioning step before the semiconductor crystal bar machining, reduces the constraint number needed by positioning, improves the machining efficiency, and reduces the error accumulation; and meanwhile, the machining method can effectively improve the utilization rate of the semiconductor crystal bars, and reduces the production cost.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a method for rounding and grooving crystal rods using a vertical rounding and slotting machine for semiconductor crystal rods. Background technique [0002] Rounding and grooving of semiconductor ingots is a very important step in semiconductor processing. Before the semiconductor crystal ingot is processed, whether the semiconductor crystal ingot can be accurately positioned will greatly affect the utilization rate of the semiconductor crystal ingot in the subsequent rounding process. The existing semiconductor spheroid grooving machine adopts the horizontal processing method, and this processing method often needs to calibrate the X-axis and Y-axis state of the semiconductor ingot when accurately positioning the semiconductor ingot. This kind of precise operation locks back and is inefficient. . Contents of the invention [0003] In order to solve the above problems,...

AI Technical Summary

Problems solved by technology

Before processing the semiconductor ingot, whether the semiconductor ingot can be accurately positioned will greatly affect the utilization rate of the semiconductor ingot in the subsequent rounding process

The existing semiconductor spheroid grooving machine adopts the horizontal processing method, and this processing method often needs to calibrate the X-axis and Y-axis state of the semiconductor ingot when accurately positioning the semiconductor ingot. This kind of precise operation locks back and is inefficient.

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