Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Test board and method for etching uniformity analysis

A test method and test board technology, applied in the direction of measuring devices, instruments, etc., can solve the problems of low work efficiency, inaccurate detection and analysis, etc., and achieve the effect of improving accuracy, improving detection and analysis efficiency, and reducing the steps of marking

Inactive Publication Date: 2019-05-21
JIANGMEN SUNTAK CIRCUIT TECH
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems of low working efficiency and inaccurate detection and analysis in the existing etching uniformity analysis device and method, the present invention provides a test board and method for etching uniformity analysis. The test board is based on the pool effect during etching. Designing the through hole for the measurement point can not only improve the detection and analysis efficiency of etching uniformity, but also greatly improve the accuracy of etching uniformity analysis results

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Test board and method for etching uniformity analysis
  • Test board and method for etching uniformity analysis

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] The production process of PCB generally includes core board cutting → negative film making inner layer circuit → pressing to make production board → drilling → sinking copper → full board electroplating → positive film process to make outer layer circuit → making solder mask layer → surface treatment → forming A PCB is produced.

[0024] In the circuit manufacturing process, the uniformity of etching is one of the important factors that cannot be ignored among the many influencing factors of fine circuit boards. The etching uniformity after copper thickness etching on the board surface is detected and analyzed, and then the etching parameters in the PCB production process are adjusted, but the selection of measurement points on the PCB surface determines the correctness of the analysis of copper thickness etching uniformity; Because when the PCB is etched through the horizontal etching line, an "etching solution pool" will be formed in the middle of the upper surface of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a test board and method for etching uniformity analysis. The test board is a flat plate; the size of the flat plate is the same as that of a to-be-tested plate; the positions,above the length of 3 / 130, 5 / 104, 5 / 52, 1 / 2, 47 / 52, 99 / 104 and 127 / 130, of the short edge of the flat plate are each provided with one column of ten through holes in the long edge direction of the flat plate; and ten through holes in each column are sequentially positioned at the positions, above the length of 3 / 155, 5 / 124, 5 / 62, 77 / 310, 129 / 310, 181 / 310, 233 / 310, 57 / 62, 119 / 124 and 152 / 155, of the long edge of the flat plate. According to the test board, the through holes of the measuring points are designed according to the pool effect during etching, so that the detection and analysis efficiency of the etching uniformity can be improved, and the accuracy of an etching uniformity analysis result is greatly improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a test board and method for etching uniformity analysis. Background technique [0002] With the development of electronic products towards miniaturization, digitalization, multi-function and high integration of electronic components, the corresponding circuit boards are also developing towards light, thin, short and small trends, and the requirements for line width and spacing of circuit boards are becoming more and more Smaller, the precision requirements of the circuit are getting higher and higher. The PCB circuit pattern not only plays the role of current conduction, but also plays the role of signal transmission. The line impedance control is becoming more and more strict, which makes it particularly important to ensure the etching uniformity of the outer circuit pattern; When etching, an "etching solution pool" will be formed in the middle of the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08
Inventor 刘红刚徐文中李江张柳李显流
Owner JIANGMEN SUNTAK CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com