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Plate-type heat pipe

A technology of plate heat pipes and flat parts, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the limitation of fin heat dissipation capacity, the decline of the uniform temperature capacity of radiators, and the heat transfer capacity of substrates To achieve the effect of improving heat dissipation, reducing contact thermal resistance, and improving temperature uniformity

Active Publication Date: 2019-05-24
常州恒创热管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current application of fins is limited to the form of mounting on the radiator substrate. When the substrate is a flat heat pipe and the fins are metal fins, the heat dissipation capacity of the fins is limited; and when the substrate is a metal plate, the fins When the sheet is a flat heat pipe, the heat transfer capability of the substrate is poor, and the above two connection structures will lead to a decrease in the uniform temperature capability of the radiator, making the heat dissipation capability poor and unable to meet the heat dissipation requirements.

Method used

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  • Plate-type heat pipe

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] See Figure 1-Figure 5 , The first embodiment of the present invention provides a plate heat pipe used to transfer and diffuse heat from a heat source (for example, electronic components or electronic equipment, etc.). The plate heat pipe includes a flat plate portion 10 and a plurality of plates arranged on the plate portion 10. The fin portion 20 is provided with a first cavity 101 on the flat plate portion 10, each fin portion 20 is provided with a second cavity 201, and each second cavity 201 is communicated with the first cavity 101, The plate heat pipe is provided with a closed cavity (not shown in the figure), the closed cavity includes a first cavity 101 and a second cavity 201, and the enclosed cavity is filled with a phase change working medium (not shown in the figure) (Shown), the fin portion 20 has a heat dissipation function. During operation, the liquid phase change working fluid in the first cavity 101 absorbs heat from the heat source and then vaporizes...

Embodiment 2

[0069] See Picture 10 The difference between the plate heat pipe provided in the second embodiment of the present invention and the plate heat pipe in the first embodiment is that: in this embodiment, the isolated part 103 is omitted. At this time, the first cavity 101 and the second cavity 102 can also be connected It also forms a part of the enclosed cavity, improves the temperature uniformity of the flat plate portion 10 in contact with the heat source and the fin portion 20 for heat dissipation, improves the heat dissipation effect, and can meet the heat dissipation needs of the surface of high-power equipment. Moreover, compared with the first embodiment, the plate heat pipe of this embodiment is easier to process, thereby effectively controlling the production cost.

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Abstract

The invention discloses a plate-type heat pipe, and the pipe comprises a flat plate part and a plurality of fin parts arranged on the flat plate part. The flat plate part is provided with a first cavity, and each fin part is provided with a second cavity, wherein each second cavity is communicated with the first cavity. Compared with a traditional structure, the plate-type heat pipe provided by the invention has the advantages that the contact thermal resistance is reduced, the temperature equalizing capability of the flat plate part in contact with a heat source and the fin part for heat dissipation is improved, the heat dissipation effect is improved, and the heat dissipation requirement of the surface of high-power equipment can be met.

Description

Technical field [0001] The present invention relates to the field of heat dissipation technology, in particular, to a plate type heat pipe. Background technique [0002] With the gradual development of electronic components in the direction of miniaturization, high power, and high performance, their development will be accompanied by a higher heat flux density, and the heat dissipation problem has gradually become a bottleneck restricting the development of highly integrated electronic components. Due to its high thermal conductivity and good temperature uniformity, flat heat pipes can quickly transfer and diffuse heat sources with high thermal density, which meets the requirements of electronic equipment for compactness, reliability, and flexibility of heat sinks, and has gradually become a research solution to high-power equipment Excellent choice for surface heat dissipation problems. [0003] At present, flat heat pipes have been used to replace traditional pure metal radiator...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F28D15/02
Inventor 黄晓峰
Owner 常州恒创热管理有限公司