Lead-free solder for sealing quartz glass

A technology of lead-free solder and quartz glass, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of high equipment requirements and complicated process, and achieve the improvement of vacuum sealing reliability and sealing process The effect of simplicity and high vacuum sealing performance

Active Publication Date: 2019-05-31
INST OF NUCLEAR PHYSICS & CHEM CHINA ACADEMY OF
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This sealing method between quartz glass and metal is c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The substrate of the lead-free solder for quartz glass sealing in this embodiment is tin, and the introduced Ti and O are composed of Ti: 0.2% and O: 0.05% in atomic percent. The melting point of lead-free solder is 231.9°C. The lead-free solder is a square block with a side length of 2 mm.

Embodiment 2

[0028] The substrate of the lead-free solder for sealing quartz glass in this embodiment is tin, and the introduced Ti and O are composed of Ti: 6% and O: 5.9% in atomic percent. The melting point of lead-free solder is 231.9°C. Lead-free solder is a sheet with a thickness of 0.25mm.

Embodiment 3

[0030] The matrix of the lead-free solder for quartz glass sealing in this embodiment is tin, and the introduced Ti and O are composed of Ti: 0.5% and O: 0.05% in atomic percent. The melting point of lead-free solder is 231.9°C. Lead-free solder is a sheet with a thickness of 0.15mm.

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PUM

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Abstract

The invention discloses lead-free solder for sealing quartz glass. A matrix of the lead-free solder is tin, and the atomic percent of introduced Ti and O is a follows: 0.2-6% of Ti and 0.05-5.9% of O.The atom ratio of Ti and O is greater than 1, and the mass percent of impurities in the lead-free solder is smaller than or equal to 0.1%. The welding temperature range of the lead-free solder is 600-800 DEG C, and the welding vacuum degree is smaller than or equal to 5*10<-3>Pa. In a quartz glass sealing process, scaling powder is not needed for the lead-free solder for sealing quartz glass, sothat the quartz glass sealing process is simplified and the vacuum sealing reliability of quartz glass sealing is improved. The lead-free solder can be widely applied to quartz glass sealing and can be also applied to welding quartz glass, glass, the softening temperature of which is not lower than 800 DEG C, taking SiO2 as a primary component, a titanium material, metals with titanium plating onthe surface and the like. The lead-free solder is in particular suitable for preparing a pulse xenon lamp, so that the service life of the pulse xenon lamp can be prolonged obviously and the working reliability of the pulse xenon lamp can be improved obviously.

Description

technical field [0001] The invention belongs to the technical field of brazing solder, in particular to a lead-free solder for quartz glass sealing. Background technique [0002] Lead-free solder for quartz glass sealing can be widely used in fields such as electric vacuum equipment, electric light sources, solar receiver tubes, and lithium batteries. The welding area has good vacuum sealing performance and high structural strength. High-power pulsed xenon lamps are widely used as pump light sources for large lasers. In the high-power pulsed xenon lamp preparation technology, how to realize the vacuum seal between quartz glass and metal has always been a technical difficulty, because the thermal expansion coefficient of quartz glass and metal is an order of magnitude different, and there is a large sealing stress. [0003] The currently widely used sealing method between quartz glass and metal is to use several transition glasses to connect quartz glass and metal to achieve...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 郝万立马永波宋虎彭述明龙兴贵张伟光周晓松曹清薇王宏波符雪梅
Owner INST OF NUCLEAR PHYSICS & CHEM CHINA ACADEMY OF
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