LED high reflectivity ultrathin coating film, and preparation method thereof

Abstract

The invention relates to a LED high reflectivity ultrathin coating film. The LED high reflectivity ultrathin coating film comprises a carrier layer, a high transparency polyimide layer, a metal plating layer, an adhesion agent layer, and a release layer which are arranged in a laminated manner; the thickness of the high transparency polyimide layer is controlled to be 3 to 50<mu>m; the thickness of the metal plating layer is controlled to be 0.1 to 3<mu>m; the thickness of the adhesion agent layer is controlled to be 3 to 100<mu>m; and preferably, the polyimide material which is high in glasstransition temperature (Tg), hardness, L* value, and penetration rate, low in a* value, b* value, haze degree, coefficient of expansion, bounciness, heat conduction coefficient, and refractive rate, and possesses system high temperature resistance is selected. The LED high reflectivity ultrathin coating film is high in reflectivity, excellent in bonding performance and optical performance, is light and thin, is long in service life, and possesses bending resistance; and the reflectivity is 94% or higher.

Description

Technical field [0001] The invention relates to a cover film, in particular to a high-reflectivity ultra-thin cover film for LEDs and a preparation method thereof. Background technique [0002] In the context of the current global energy shortage, energy conservation is an important issue facing us in the future. In the field of lighting, the application of LED luminous products is attracting the attention of the world. LED is a new type of green light source product. , It must be the trend of future development. The 21st century will enter the era of new lighting sources represented by LEDs. LED strips refer to the assembly of LEDs on a ribbon-shaped FPC (flexible circuit board) or PCB hard board to form a strip Shaped LED lamp structure, covering film as the insulating layer and substrate material of the LED flexible light bar, is an important part of it. Currently, there are two main types of coverage: [0003] 1. White ink type cover film. This type of cover film is usually c...

AI Technical Summary

Problems solved by technology

This kind of covering film can be made to a very low thickness (about 10um), but it often produces yellowing phenomenon during the high temperature manufacturing process, resulting in a decrease in reflectivity, and it is more likely to crack or even fall off after long-term use, which affects the service life ;

[0004] 2. White polyimide-type cover film. This type of cover film also has the problem of yellowing. There are various types of polyimide, and groups such as bisphenol A that cause yellowing of the film will reduce the reflectivity of the product after high-temperature processing. , the use of polyimide resistant to high temperature yellowing also needs to consider the cost issue; at the same time, adding white pigments and fillers to polyimide, the elastic modulus, elongation, tensile strength and other physical properties of polyimide itself will all be reduced. At the same time, in order to cover the underlying circuit, white polyimide is difficult to achieve ultra-thin thickness, which has cost problems. If it is made to be extremely thin, there will also be processing operability problems

Images