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Positive temperature coefficient circuit protection device and preparation method thereof

A positive temperature coefficient and circuit protection technology, which is applied to the assembly of printed circuits with electrical components, printed circuits connected to non-printed electrical components, resistor terminals/electrodes, etc., can solve heat dissipation, damage, and positive temperature coefficient circuit protection devices 1 Poor operating efficiency and other issues

Active Publication Date: 2021-03-09
FUZETEC TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the aforementioned design will cause heat dissipation problems between the substrate 9 and the PTC circuit protection device 1
Therefore, the positive temperature coefficient circuit protection device 1 may be damaged due to overheating resulting in poor operating efficiency

Method used

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  • Positive temperature coefficient circuit protection device and preparation method thereof
  • Positive temperature coefficient circuit protection device and preparation method thereof
  • Positive temperature coefficient circuit protection device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] 10.25g of high-density polyethylene (as ungrafted olefin polymer; purchased from Taiwan Plastics; model HDPE9002), 10.25g of maleic anhydride-grafted high-density polyethylene (as carboxylic anhydride-grafted olefin Polymer; purchased from DuPont; model MB100D) and 29.5g carbon black (as a granular conductive filler; purchased from Columbian Chemicals Co.; model Raven 430UB) were mixed and extruded in a mixer (Brabender) (mixing time 10min; mixing temperature 200° C.; stirring speed 30 rpm), a complex mixture was obtained.

[0071] The composite mixture was hot pressed to form a PTC polymer layer 22 sheet with a thickness of 0.35 mm. Among them, the hot-pressing temperature is 200°C, the hot-pressing time is 4 minutes, and the hot-pressing pressure is 80kg / cm 2 .

[0072] Two copper foils (as the first and second electrodes 21, 23) are respectively arranged on the two opposite sides of the positive temperature coefficient polymer layer 22, and are heated at 200°C and ...

Embodiment 2

[0079]The steps and conditions of preparing the positive temperature coefficient circuit protection device of the embodiment 2 (E2) are similar to the embodiment 1, the difference is that the first extension part 323 and the second extension part 423 are extended toward each other. refer to image 3 , to illustrate the positive temperature coefficient circuit protection device of Embodiment 2 (E2).

[0080] After testing the electrical properties of the test sample of Example 2 (E2), the results obtained are shown in Table 1.

Embodiment 3、5 and 7

[0081]

[0082] The steps and conditions of the positive temperature coefficient circuit protection device of preparation embodiment 3, 5 and 7 (E3, E5 and E7) are similar to this embodiment 1 (with figure 2 shape), the difference is that the first and second standing heights (H 1 ,H 2 ) is 0.2mm, the first and second standing heights (H 1 ,H 2 ) is 1.0mm, the first and second standing heights (H 1 ,H 2 ) is 2.0mm.

[0083] After testing the electrical properties of the test samples of Examples 3, 5 and 7 (E3, E5 and E7), the results obtained are shown in Table 1.

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Abstract

A positive temperature coefficient circuit protection device and its preparation method. The positive temperature coefficient circuit protection device comprises a polymer positive temperature coefficient element, a first conductive unit and a second conductive unit. The polymer positive temperature coefficient element includes a positive temperature coefficient polymer layer, a first electrode and a second electrode. The first conductive unit includes a first conductive member and a first conductive pin. The first conductive member has a terminal portion. The first conductive pin has a first distal end. The second conductive unit includes a second conductive member and a second conductive pin. The second conductive member has a terminal portion. The second conductive pin has a second distal end. Neither the first standing height from the first conductive member to the first distal end nor the second standing height from the first conductive member to the second distal end is less than 0.1 mm.

Description

technical field [0001] The invention relates to a positive temperature coefficient (Positive Temperature Coefficient; PTC for short) circuit protection device and a preparation method thereof, in particular to a surface-mounted positive temperature coefficient circuit protection device and a preparation method thereof. Background technique [0002] refer to figure 1 , US 5,852,397 discloses an existing surface mount positive temperature coefficient circuit protection device 1, which is used to be mounted on a substrate 9 (eg, a circuit board). The positive temperature coefficient circuit protection device 1 includes a positive temperature coefficient element 13 , a first electrode portion 11 , a second electrode portion 12 , a first conductive portion 14 and a second conductive portion 15 . In addition, a plurality of electroplating layers 18 are formed on the first and second electrode portions 11 , 12 and the first and second conductive portions 14 , 15 . [0003] In ord...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C1/14H05K1/18H05K3/34
Inventor 陈继圣江长鸿
Owner FUZETEC TECHNOLOGY CO LTD