Test device and method for detecting bonding strength of semiconductor device

A testing device and technology for bonding strength, applied in the field of testing devices for testing the bonding strength of semiconductor devices, can solve problems such as measurement failure, and achieve the effects of reducing cutting force, small deformation, and ensuring controllability
CN109932315APending Publication Date: 2019-06-25深圳市德瑞茵精密科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳市德瑞茵精密科技有限公司
Publication Date
2019-06-25

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Abstract

The invention discloses a test device for detecting the bonding strength of a semiconductor device, and relates to the technical field of semiconductor detection to solve the problem that a semiconductor device bonding strength test device in the prior art is prone to measurement failure. The test device comprises a mounting plate on which a composite cantilever beam is fixedly mounted. A displacement sensor for measuring the displacement change of the free end of the composite cantilever beam is fixedly mounted on the upper end of the composite cantilever beam on the mounting plate. By meansof the displacement sensor fixed to the mounting plate and used for detecting the position of the free end of the composite cantilever beam, the test device detects the position of a test cutter in real time during a process that the test cutter cuts a semiconductor material layer, ensures that the test cutter does not cause excessive penetration and insufficient penetration, thereby avoiding testfailure.
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Description

Technical field

[0001] The present invention relates to the technical field of semiconductor testing, in particular to a testing device and a testing method for testing the bonding strength of semiconductor devices. Background technique

[0002] With the continuous development of semiconductor technology, more and more functions are integrated on the wafer substrate with a small size, the wiring on the wafer substrate is becoming more and more dense, the circuit stack is more and more, the bonding point of the semiconductor device The circuit layer where the pad is located is under the passivation layer or circuit layer or other protective layer on the surface of the device, and the bonding point pad has a narrow space. Conventional shear testing methods cannot be used, and the test tool must pass through the surface passivation layer or circuit Layers or other protective layers can perform effective bond strength testing.

[0003] Chinese patent application number "ZL201110157669...

Claims

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