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Method for calibrating a scanner, and machining device

A scanning device and calibration scanning technology, applied in manufacturing, measuring devices, additive processing, etc., can solve problems such as geometric errors, and achieve the effect of improving accuracy and improving detectability

Active Publication Date: 2019-06-25
TRUMPF LASERSYST FOR SEMICON MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the projection of a predetermined pattern onto the image field by means of such a scanning device usually has a certain geometrical error

Method used

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  • Method for calibrating a scanner, and machining device
  • Method for calibrating a scanner, and machining device

Examples

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Embodiment Construction

[0039] figure 1 An exemplary structure of a processing machine 1 is shown for producing three-dimensional components 2 by irradiating powder layers 3 which are figure 1 In the example shown, they are arranged one above the other and form a powder bed in which the three-dimensional component 2 is embedded. The processing machine 1 has an irradiation device 4 with a laser source 5 in the form of a fiber laser for generating a laser beam 6 which is guided via an optical cable 7 and a collimation device 8 onto a deflecting mirror 9 . In the example shown, laser beam 6 is a pilot laser beam for calibration (see below). To irradiate or locally melt the powder layer 3 , a relatively high-power processing laser beam is used, which is also generated by a laser source 5 in the form of a fiber laser. In the example shown, the pilot laser beam 6 has a different wavelength than the processing laser beam. exist figure 1In the example shown, the deflection mirror 9 has a dielectric coati...

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Abstract

The invention relates to a method for calibrating a scanner (11) in order to position a laser beam (6) in a machining field (13), having the following steps: arranging at least one retroreflector (19)in the machining field (13) of the scanner (11), said machining field being formed preferably in a machining chamber (15) for irradiating powder layers (3); detecting laser radiation (20) reflected back into the scanner (11) when the laser beam (6) traverses the retroreflector (19); ascertaining an actual position (XP, YP) of the laser beam (6) in the machining field (13) using the detected laserradiation (20); and calibrating the scanner (11) by correcting a laser beam (6) target position (XT, YT) specified for the scanner (11) in the machining field (13) using the ascertained actual position (XP, YP) of the laser beam (6) in the machining field (13). The invention also relates to a corresponding machining tool (1) for producing three-dimensional components (2) by irradiating powder layers (3).

Description

technical field [0001] The invention relates to a method for calibrating a scanning device for positioning a laser beam in a processing area. The invention also relates to a processing machine for producing three-dimensional components by irradiating powder layers. Background technique [0002] Scanning devices for directing or positioning the laser beam on the processing area generally have at least one, usually two deflectable, rotatable scanning mirrors. In such scanning devices, pincushion-shaped image distortions usually result due to their construction in the processing region of the scanning device, which is also referred to below as the image field. The conversion factor of the rotational movement of the scanning mirror into the movement of the position of the laser beam in the image field also depends on the distance between the scanning device and the image field. Therefore, the projection of a predetermined pattern onto the image field by means of such a scannin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y10/00B33Y30/00B29C64/00G12B13/00G01N27/00G02B26/08G02B27/00G01S5/16
CPCB23K26/00B23K26/702B22F12/49B22F12/41B22F12/44B22F10/31B22F2999/00B22F10/28B22F2203/03G01S5/16G05B19/401B22F2998/10B33Y10/00B33Y30/00B33Y50/02B29C64/153B29C64/268G05B2219/49018G02B5/122G02B26/101G02B27/62G02B7/003B23K26/342B23K26/082Y02P10/25B23K26/354B23K26/34
Inventor M·阿伦贝里-拉贝J·奥特曼
Owner TRUMPF LASERSYST FOR SEMICON MFG