Laser annealing device

Abstract

The present invention relates to the technical field of the display and discloses a laser annealing device including a base on which a working surface is formed, the working surface includes a placement area for placing a substrate and an edge area located around the placement area. A beam cut-off device is disposed on the working surface, the orthographic projection of the beam cut-off device onthe working surface at least covers the edge area. The laser annealing device also comprises a laser device whose light irradiation direction faces the working surface, a light cutter is set in the light irradiation direction of the laser device and is used for cutting the laser emitted by the laser device into a laser beam of a preset length, wherein the a preset angle is formed by the length direction of the laser beam of the preset length and an edge of the placement area, the laser beam of the preset length and the base can move relatively to form a laser scanning surface which performs laser annealing on the substrate, and the orthographic projection of the laser scanning surface on the substrate can cover the placement area. The laser annealing device can maximize substrate utilization.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a laser annealing device. Background technique [0002] Laser annealing equipment is the key process equipment in low-temperature polysilicon technology (LTPS) and flexible OLED process flow, and its process determines the process quality of transforming amorphous silicon into polysilicon. In the flexible OLED process, the laser annealing process usually uses an oblique scan to a certain angle. The process is to use a beam cutter (Beam Cutter) to intercept the laser beam of a specific length, and then move the base carrying the substrate at a certain angle. After the laser irradiation, the amorphous silicon layer A-Si on the substrate is melted and recrystallized into Polysilicon layer P-Si. In order to reduce static electricity and particles during the scanning process, the material of the abutment is aluminum, and the laser cannot be directly irradiated on the surface of the...

AI Technical Summary

Problems solved by technology

In order to reduce static electricity and particles during the scanning process, the material of the abutment is aluminum, and the laser cannot be directly irradiated on the surface of the abutment, otherwise it will cause damage to the abutment and affect the crystallization effect

Therefore, no laser light can be irradiated on the area other than the substrate during scanning

Therefore, when scanning at an oblique angle, in order to prevent the laser from irradiating the abutment, the length of the beam stopper will be shorter, and the starting position of the abutment will be closer to the inside, so that the crystallization area of ​​the substrate will be reduced and the utilization rate of the substrate will be reduced.

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