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A microchannel cold plate with bubbling partition walls and electronic equipment

A micro-channel plate and micro-channel technology, which is applied to circuits, electrical components, and electrical solid devices, can solve problems such as increased volume and weight of electronic equipment, low heat exchange efficiency, and unsatisfactory heat exchange effects.

Active Publication Date: 2021-04-16
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although natural air cooling has the advantages of easy implementation, low price, and simple thermal control device, its heat transfer efficiency is low and it is greatly affected by the environment; forced air cooling has better heat dissipation effect than natural air cooling and is easy to implement, but the heat transfer effect is still Not ideal; although conventional liquid cooling can achieve a good heat dissipation effect, it adds a liquid circulation system, which increases the size and weight of electronic equipment

Method used

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  • A microchannel cold plate with bubbling partition walls and electronic equipment
  • A microchannel cold plate with bubbling partition walls and electronic equipment
  • A microchannel cold plate with bubbling partition walls and electronic equipment

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Embodiment Construction

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0026] In 1981, the concept of micro-channel heat dissipation was first proposed. After that, people made micro-channel cold plates according to the concept of micro-channel heat dissipation. Due to the advantages of high area-to-volume ratio, large convective heat transfer coefficient, small volume and light weight, microchannel cold plate has become an important cooling device for electronic equipment with small size and high heat flux density.

[0027] The microchannel cold plate has microchannels in it. The heat transfer and flow characteristics of fluid in microchannels are different from macroscopic channels, which involve complex mixing mechanisms such as fluid evaporation, boiling, bubble generation, single-phase / gas-liquid two-p...

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Abstract

The embodiment of the invention provides a microchannel cold plate with bubbling partition walls and electronic equipment. The microchannel cold plate with bubbling partitions comprises a plurality of microchannel plates and a plurality of microchannel partition plates arranged in a staggered manner, each microchannel plate is formed with microchannels, and the microchannels are located between adjacent two Between two microchannel partitions, and at least one side of part or all of the microchannel partitions is formed with a bubble structure, and / or, part or all of the at least one side of the microchannel is formed with bubbles structure. The bubbling structure on the wall plate between the microchannels can enhance the convective heat transfer and heat dissipation performance of the microchannel cold plate.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a microchannel cold plate with bubble partition walls and electronic equipment using the microchannel cold plate. Background technique [0002] In recent years, the feature size of electronic chips has been continuously reduced, moving towards miniaturization, and the degree of integration has also increased at a very high rate year by year, resulting in a rapid increase in the power density of electronic devices. Traditional heat dissipation technology can no longer meet the cooling needs of tiny electronic devices. [0003] Traditional heat dissipation technologies are mainly air cooling and conventional liquid cooling. The air cooling includes natural air cooling and forced air cooling. Although natural air cooling has the advantages of easy implementation, low price, and simple thermal control device, its heat transfer efficiency is low and it is greatly affected b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/427H01L23/473
Inventor 陈良陈双涛李星辰薛绒侯予王为斌肖润锋
Owner XI AN JIAOTONG UNIV