Electrode welding structure of laser bar

Abstract

The invention provides an electrode welding structure of a laser bar. The structure comprises a laser bar which is used as a light-emitting chip and is welded to a transition heat sink in an invertedway with a positive electrode surface facing down. The transition heat sink is welded with a metal material with a matched thermal expansion coefficient on a microchannel heat sink, a negative electrode surface of the laser bar is welded to a negative conductive layer with a sawtooth structure, an insulating layer whose thickness is matched with the sum of the transition heat sink and the laser bar is arranged between the negative conductive layer and the microchannel heat sink, and the microchannel heat sink provides efficient heat dissipation to the laser bar while acting as a positive conductive layer. The design of the conductive layer with the sawtooth structure has a flat electrode lead structure, the bending stress caused by conventional gold wire welding is avoided, the electricalconductivity of the electrode layer is effectively improved, and the stability of the long-time working of the laser bar is ensured.

Description

technical field [0001] This application belongs to the field of laser technology, in particular, it relates to high-power semiconductor laser packaging electrode welding technology. Background technique [0002] In recent years, high-power semiconductor lasers have been used more and more widely in the fields of laser pumping, medical treatment, display lighting, and industrial processing. With the demand for high power semiconductor lasers in applications, laser chips with high-power output bars The package directly improves the output power level of the semiconductor laser, especially for the package of bar chip array and stack structure, the output power can reach tens of thousands of watts. The packaging of the laser bar chip greatly improves the output power of the semiconductor laser, but also forms a large amount of waste heat, and puts forward strict requirements on the heat sink structure and packaging technology. [0003] In order to achieve efficient heat dissi...

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Problems solved by technology

Due to the high-power output of the bar requires high-power power supply, it is often necessary to weld dozens or hundreds of gold wires on the upper surface of the bar, which requires extremely high gold wire bonding technology; in addition, the bar is welded to the microchannel heat sink It is necessary to use a transitional heat sink as a stress relief layer for welding, resulting in a height difference between the upper surface of the bar and the electrode sheet of the negative electrode. When the gold wire is bonded, the gold wire must form a certain arc to meet the welding requirements, resulting in the bending of the gold wire. The uneven stress affects the stability of gold wire bonding, which in turn affects the stability of the entire laser bar

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