Electrolytic polishing and residual stress detection integrated device

An electrolytic polishing and residual stress technology, which is applied in the direction of measuring devices, electrolytic processes, electrolytic components, etc., can solve the problems of low detection error, difficult to accurately locate detection points and detection efficiency, and achieve the effect of preventing corrosion and improving efficiency and accuracy

Pending Publication Date: 2019-07-02
FUJIAN UNIV OF TECH
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AI Technical Summary

Problems solved by technology

In the original depth detection, it is necessary to disassemble and move the sample to the outside for electrolytic polishing and then re-clamping before the residual stress detection can be carried out. Repeated disassembly and movement of the samp

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  • Electrolytic polishing and residual stress detection integrated device
  • Electrolytic polishing and residual stress detection integrated device
  • Electrolytic polishing and residual stress detection integrated device

Examples

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[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0026] Such as Figure 2-6 As shown, an integrated device for electrolytic polishing and residual stress detection includes an X-ray diffraction system 1, a detection head 11, a working platform 2, a polishing liquid recovery device 71, an anti-corrosion flushing device 77, a horizontal servo motor 3, and a vertical servo motor 4. Fixture device 5, sample 6, online electrolytic polishing system 7. A working platform 2 is placed under the detection head of the X-ray diffraction system 1, and a fixture device 5 for fixing the sample is provided on the working platform. The sample is fixed on a working platform; the working platform is provided with a horizontal servo motor 3 and a vertical servo motor 4, and the working platform is driven by the horizontal servo motor, the vertical servo motor and the ball screw t...

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Abstract

The invention belongs to the technical field of sample residual stress detection and discloses an electrolytic polishing and residual stress detection integrated device. The electrolytic polishing andresidual stress detection integrated device comprises an X-ray diffraction system, a detection head, a working platform, a polishing solution recovery device, an anti-corrosion flushing device, a transverse servo motor, a longitudinal servo motor, a clamp device, a sample piece and an online electrolytic polishing system, the working platform for fixing the sample piece is placed below the detection head of the X-ray diffraction system, the transverse servo motor and the longitudinal servo motor are arranged on the working platform, and the working platform is driven to move transversely andlongitudinally through the transverse servo motor, the longitudinal servo motor and a ball lead screw; the clamp device for fixing the sample piece is arranged on the working platform; and the onlineelectrolytic polishing system is arranged on one side of the working platform and provided with the polishing solution recovery device and the anti-corrosion flushing device. Residual stress detectionthrough X-ray diffraction, electrolytic polishing and liquid recovery are integrated.

Description

technical field [0001] The invention belongs to the technical field of sample residual stress detection, and in particular relates to an integrated device for electrolytic polishing and residual stress detection. Background technique [0002] Such as figure 1 As shown, the principle of X-ray diffraction method: X-rays are irradiated on the polycrystal, when the X-ray optical path difference 2dsinθ of two adjacent atomic surfaces is an integer multiple of the wavelength λ, diffraction will occur, and the Bragg equation 2dsinθ=nλ is satisfied at this time , where d is the interplanar spacing of the material, θ is the diffraction angle, and λ is the characteristic line wavelength of the X-ray tube target. The X-ray stress meter obtains the change of the microscopic interplanar spacing d by measuring the diffraction angle 2θ. Apply the elastic mechanics theory to calculate the stress σ=k·M of the material, where k is the stress constant, M=(2θ) / (sinΨ), and M needs to be determ...

Claims

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Application Information

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IPC IPC(8): C25F3/16C25F7/00G01L1/25G01L5/00
CPCC25F3/16C25F7/00G01L1/25G01L5/0047
Inventor 许明三张正曾寿金黄旭王涛
Owner FUJIAN UNIV OF TECH
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