Electrolytic polishing and residual stress detection integrated device

Abstract

The invention belongs to the technical field of sample residual stress detection and discloses an electrolytic polishing and residual stress detection integrated device. The electrolytic polishing andresidual stress detection integrated device comprises an X-ray diffraction system, a detection head, a working platform, a polishing solution recovery device, an anti-corrosion flushing device, a transverse servo motor, a longitudinal servo motor, a clamp device, a sample piece and an online electrolytic polishing system, the working platform for fixing the sample piece is placed below the detection head of the X-ray diffraction system, the transverse servo motor and the longitudinal servo motor are arranged on the working platform, and the working platform is driven to move transversely andlongitudinally through the transverse servo motor, the longitudinal servo motor and a ball lead screw; the clamp device for fixing the sample piece is arranged on the working platform; and the onlineelectrolytic polishing system is arranged on one side of the working platform and provided with the polishing solution recovery device and the anti-corrosion flushing device. Residual stress detectionthrough X-ray diffraction, electrolytic polishing and liquid recovery are integrated.

Description

technical field [0001] The invention belongs to the technical field of sample residual stress detection, and in particular relates to an integrated device for electrolytic polishing and residual stress detection. Background technique [0002] Such as figure 1 As shown, the principle of X-ray diffraction method: X-rays are irradiated on the polycrystal, when the X-ray optical path difference 2dsinθ of two adjacent atomic surfaces is an integer multiple of the wavelength λ, diffraction will occur, and the Bragg equation 2dsinθ=nλ is satisfied at this time , where d is the interplanar spacing of the material, θ is the diffraction angle, and λ is the characteristic line wavelength of the X-ray tube target. The X-ray stress meter obtains the change of the microscopic interplanar spacing d by measuring the diffraction angle 2θ. Apply the elastic mechanics theory to calculate the stress σ=k·M of the material, where k is the stress constant, M=(2θ) / (sinΨ), and M needs to be determ...

AI Technical Summary

Problems solved by technology

In the original depth detection, it is necessary to disassemble and move the sample to the outside for electrolytic polishing and then re-clamping before the residual stress detection can be carried out. Repeated disassembly and movement of the sample makes it difficult to accurately locate the detection point and cause detection efficiency. Low and large detection errors, etc., the present invention effectively solves these problems, greatly improving the efficiency and accuracy of detection

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