Thermal superconducting heat dissipating plate and finned heat sink

Abstract

The invention provides a thermal superconducting heat dissipating plate and a finned heat sink. The thermal superconducting heat dissipating plate is used for dissipating heat of heating elements suchas a power device. A thermal superconducting pipeline is formed in the thermal superconducting heat dissipating plate, is a closed pipeline, is filled with a heat transfer working medium, and is provided therein with an enhanced heat transfer structure portion. The enhanced heat transfer structure portion is located on the inner wall of the thermal superconducting pipeline adjacent to a heating element to increase the heat exchange area of the thermal superconducting pipeline. The thermal superconducting heat dissipating plate can increase the heat exchange area between the thermal superconducting pipeline and the heating element and reduce thermal resistance by disposing the enhanced heat transfer structure portion on the inner wall of the thermal superconducting pipeline adjacent to theheating element, so that the heat transfer capability of the thermal superconducting heat dissipating plate is remarkably enhanced. When inserted into a heat sink substrate to which the heating element is attached, the thermal superconducting heat dissipating plate can reduce a temperature difference between the thermal superconducting heat dissipating plate and the heat sink substrate, namely the temperature difference between the thermal superconducting heat dissipating plate and the heating element, and improves the heat dissipation capability of the thermal superconducting heat dissipating plate.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a thermal superconducting cooling plate and a fin radiator. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in solar inverters, uninterruptible power supplies (UPS), charging piles, power MosFET (metal oxide semiconductor field effect transistor), Diode (diode), IGBT ( Insulated Gate Bipolar Transistors) and other power devices. As the integration of these power components is getting higher and higher, the power density is also increasing, and the heat generated by themselves during work is also increasing. If the heat generated by the power devices cannot be dissipated in time and quickly, it will lead to power failure. The temperature of the chip in the device rises, which will cause ...

AI Technical Summary

Problems solved by technology

However, the inner wall of the heat transfer pipeline in the heat dissipation plate of the prior art is generally smooth, the heat transfer area of ​​the heat transfer pipeline is small, the thermal resistance is large, and the heat transfer capacity is limited

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