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Integrated wafer dicing knife and wafer dicing method

A cutting method and technology of cutting knives, which are applied in semiconductor/solid-state device manufacturing, grinding machine tools, manufacturing tools, etc., can solve the problems of low cutting efficiency and achieve the effect of improving use efficiency

Active Publication Date: 2021-09-17
CHIPMOS TECHSHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the wafer cutting method generally uses the first knife to open the cutting groove on the wafer, and then uses the second knife to cut and separate, and the cutting efficiency is low.

Method used

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  • Integrated wafer dicing knife and wafer dicing method
  • Integrated wafer dicing knife and wafer dicing method
  • Integrated wafer dicing knife and wafer dicing method

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Embodiment Construction

[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0052] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", and "circumferential" are based on...

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Abstract

The embodiment of the present invention discloses an integrated wafer dicing knife, comprising: a knife holder, a first blade and a second blade. The first blade is fixedly arranged on the knife holder, and the second blade is fixedly arranged on the first blade, and both the first blade and the second blade are circular cylinders and are concentric. By designing the wafer dicing knife and designing an integrated wafer dicing knife, the operation mode that originally required two blades to cut twice is optimized into an integrated dicing knife for one-time cutting, and the grooving and cutting of the wafer can be completed. Separate jobs. The embodiment of the invention also discloses a wafer cutting method, which uses the integrated wafer cutting knife designed in the invention, so that the use efficiency of the dicing machine is improved.

Description

technical field [0001] Embodiments of the present invention relate to the design of a wafer cutting tool and a wafer cutting method, in particular to an integrated wafer cutting knife and a wafer cutting method. Background technique [0002] Wafer cutting in the semiconductor industry generally uses a set of blades installed on the dicing machine, and the wafer is cut through the high-speed movement of the blade (30,000-50,000 rpm), so that the chip is cut from the wafer split up. [0003] At present, the way of dicing wafers is generally to use the first knife to open the dicing groove on the wafer, and then use the second knife to perform cutting and separation, and the cutting efficiency is low. Contents of the invention [0004] The object of the present invention is to provide an integrated wafer cutting knife and a wafer cutting method, the design of the integrated wafer cutting knife can complete the grooving and separation operations of the wafer, and improve the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B24B37/04H01L21/78
CPCB24B37/042B28D5/029H01L21/78
Inventor 沈珏玮
Owner CHIPMOS TECHSHANGHAI
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