A 3D Integrated Passive Filter Based on Coaxial TSV

Abstract

The invention relates to a three-dimensional integrated passive filter based on coaxial through silicon vias. The capacitor sequentially comprises a first spiral inductance layer, a first plate capacitor layer, a through-silicon-via capacitor layer, a second plate capacitor layer and a second spiral inductance layer from top to bottom, wherein the through-silicon-via capacitance layer comprises asubstrate and a plurality of through-silicon-via structures penetrating through the substrate, each through-silicon-via structure is connected with the first flat-plate capacitance layer and the second flat-plate capacitance layer, and a coupling capacitor is formed between the adjacent through-silicon-via structures. According to the passive filter, the inductors and the capacitors are sequentially stacked in a three-dimensional mode to form a trapezoidal network of the inductors and the capacitors, the three-dimensional integrated passive filter is formed, and the passive filter has the advantages of being small in size, flexible in design, easy to integrate in a three-dimensional mode, good in frequency selection performance and the like.

Description

technical field [0001] The invention belongs to the technical field of passive electronic devices, and in particular relates to a three-dimensional integrated passive filter based on coaxial through-silicon holes. Background technique [0002] With the improvement of integration and performance of modern communication systems, various electronic chips and functional circuit modules are developing towards miniaturization. Fully meet the development requirements of filters in RF / microwave integrated circuits. On the one hand, its processing accuracy is not high, the parasitic electromagnetic effect is serious, and the interconnection density is low, which is not suitable for the requirements of high-frequency radio frequency and microwave integrated circuits; on the other hand, capacitors, inductors, and filters based on LTCC and MCM technologies Passive devices such as passive devices occupy a large area, which seriously limits the improvement of system integration. [0003...

AI Technical Summary

Problems solved by technology

[0002] With the improvement of integration and performance of modern communication systems, various electronic chips and functional circuit modules are developing towards miniaturization. Fully meet the development requirements of filters in RF / microwave integrated circuits

On the one hand, its processing accuracy is not high, the parasitic electromagnetic effect is serious, and the interconnection density is low, which is not suitable for the requirements of high-frequency radio frequency and microwave integrated circuits; on the other hand, capacitors, inductors, and filters based on LTCC and MCM technologies Passive devices such as passive devices occupy a large area, which seriously limits the improvement of system integration.

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