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Micro electro mechanical system (MEMS) chip structure

A technology of chip structure and ring structure, which is applied in the field of MEMS chips, can solve the problems of performance degradation and complicated control of micromirrors, and achieve the effect of reducing the influence of thermal crosstalk, small size and more volume

Active Publication Date: 2019-07-09
HUAWEI TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to extremely complex control of the micromirror and reduced performance

Method used

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  • Micro electro mechanical system (MEMS) chip structure
  • Micro electro mechanical system (MEMS) chip structure
  • Micro electro mechanical system (MEMS) chip structure

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Embodiment Construction

[0037] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0038] The application relates to a MEMS chip structure, which is a core device constituting an optical switch in the field of optical switching. figure 1A schematic block diagram of a MEMS optical switch is shown, including an input port array, an input micromirror array, an output micromirror array, and an output port array, wherein the input port array is used to receive optical signals; the input The micromirror array at the end reflects the received optical signal to the micromirror array at the output end; the micromirror array at the output end reflects the optical signal reflected by the micromirror array at the input end to the output port array, thereby sending it out; wherein, the micromirror array at the input end or The micromirrors included in the micromirror array at the output end ca...

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Abstract

The invention discloses a micro electro mechanical system (MEMS) chip structure. The MEMS chip structure comprises a substrate, a side wall, a dielectric plate, an MEMS micromirror array and a grillearray, wherein the side wall is of an annular structure, an opening in one side of the side wall is covered with the substrate, an opening in the other side of the side wall is covered with the dielectric plate, and a hollow structure is constituted by the side wall, the substrate and the dielectric plate; the MEMS micromirror array and the grille array are both located in the hollow structure; the MEMS micromirror array is located on the substrate and comprises a plurality of grooves and a plurality of MEMS micromirrors, wherein the multiple MEMS micromirrors are in one-to-one correspondencewith the multiple grooves, and the multiple MEMS micromirrors are located in the corresponding grooves or above the corresponding grooves; and the grille array is located on the MEMS micromirror array, and the lower surface of the grille array is connected with the upper surfaces of the side walls of at least part of the multiple grooves.

Description

technical field [0001] The present application relates to the field of MEMS chips, in particular to a structure of an electrothermal MEMS chip. Background technique [0002] Due to the advantages of large scanning angle, low driving voltage, low manufacturing cost, and simple control, electrothermal microelectromechanical system (MEMS) micromirrors have attracted much attention in the fields of optical imaging, medical detection, microdisplay, and optical communication. Especially in the field of optical communication, the electrothermal MEMS micromirror array chip with large rotation angle is suitable for assembling large-scale optical cross-connect (optical cross-connect, OXC) modules. [0003] However, after the electrothermal MEMS micromirror is integrated in the array, there is a problem of thermal crosstalk; when one or more micromirrors adjacent to the working micromirror start to work, the heat generated will change the ambient temperature distribution around the wor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B26/08B81B7/02
CPCG02B26/0833B81B7/02B81C1/00317B81B3/0081B81B2203/0163B81B2201/045B81B3/0083B81B2201/042B81B2203/0323G02B26/0866
Inventor 陈奕文黄兆兴姚丹阳汤红蒋臣迪谢会开
Owner HUAWEI TECH CO LTD
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