Spot plating electrode module and spot plating device

Abstract

The invention discloses a spot plating electrode module and a spot plating device, and relates to the field of electroplating. The device comprises an insulating upper cover and an insulating lower cover, wherein the insulating upper cover and the insulating lower cover are encircled to form a cavity, a through hole for plating liquid pressed into the cavity is formed in the insulating upper cover, the butt joint surface of the insulating lower cover and the insulating upper cover is provided with a liquid outlet communicating with the cavity, the liquid outlet comprises a plurality of liquidspraying grooves extending outwards along the butt joint surface, and anode coating is coated on the inner walls of the liquid spraying grooves. The insulating upper cover and the insulating lower cover encircle to form a cavity, the plating liquid is pressed into the cavity through the through hole, liquid spraying grooves extending outwards is arranged on the butt joint surface of the insulatinglower cover, and the liquid spraying grooves communicate with the cavity; when the plating liquid is pressed into the cavity, the liquid is sprayed outwards through the liquid spraying grooves, and then the liquid is accurately sprayed onto the material belt through the liquid spraying grooves, the redundant plating liquid is not needed to be removed, so that the plating liquid is saved, the working procedures are reduced, and the electroplating efficiency is improved; the anode coating coated on the inner walls of the liquid spraying grooves can enhance the conductivity of the inner walls ofthe liquid spraying grooves and accelerate the electron flow speed, and the spot plating is high in adhesion degree, fast in speed and is more uniform.

Description

Technical field [0001] The invention relates to electroplating technology, more specifically, it relates to a spot plating electrode module and a spot plating device. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a metal film to the surface of a metal or other material to prevent metal oxidation. Improve wear resistance, electrical conductivity, reflectivity, corrosion resistance and enhance aesthetics. [0003] When electroplating electronic components, most of the electroplating equipment used in the prior art is a plating bath. The workpiece is immersed in the bath for overall electroplating. This method will cause the parts to be plated that do not need to be electroplated. A layer of metal, and the excess electroplating part usually needs to be cut off, or the excess plating layer is ground off, w...

AI Technical Summary

Problems solved by technology

[0003] When electroplating electronic components, most of the electroplating equipment used in the prior art is a plating solution tank, and the workpiece is immersed in the plating solution tank for overall electroplating. This method will cause the parts of the parts to be plated that do not need to be electroplated to be electroplated A layer of metal, and the excess electroplating usually needs to be cut off, or the excess plating should be ground off, which not only causes a waste of materials, but also increases the processing procedures, resulting in an increase in production costs

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