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Jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process

A system-in-package, radio frequency chip technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problem of not filling up

Active Publication Date: 2019-07-12
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, in practical applications, because the adapter board used as the carrier board needs to be used as a TSV to be used as a Unicom conductive column, and the current equipment that can fill the conductive column can reach a maximum of 200um, and the deeper the hole can only be covered with a metal coating on the hole wall. , cannot fill

Method used

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  • Jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process
  • Jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process
  • Jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process

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Embodiment Construction

[0047] Embodiments of the present invention are described in detail below, wherein the same or similar reference numerals represent the same or similar elements or elements with similar functions. The embodiments described below by referring to the figures are exemplary, and are only used to explain the present invention and not to limit the present invention.

[0048] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and unless defined as herein, will not be used in an idealized or overly formal meaning to explain.

[0049] The present invention will be further described below in ...

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Abstract

The invention discloses a jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process which comprises the steps of (101) the preliminary processing of a cover plate, (102) cover plate thinning processing, (103) intermediate layer processing, (104) base processing, and (105) packaging. The present invention provides the jack-type ultra-deep TSV interconnected radio frequency chip system-level packaging process with ultra-deep TSV hole filling.

Description

technical field [0001] The invention relates to the technical field of semiconductors, more specifically, it relates to a jack-type ultra-deep TSV interconnected radio frequency chip system level packaging process. Background technique [0002] Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. Millimeter-wave radio frequency integrated circuits also have huge actual needs and potential markets. [0003] In the context of the post-Moore's Law era, it has become more difficult to increase integration through the traditional way of reducing the size of transistors. The current electronic system is developing in the direction of miniaturization, diversification, and intelligence, and will eventually form a highly integrated and low-cost comprehensive electronic system that integrates multiple functions such as perception, communication, processing, and transmission. The core ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/60
CPCH01L21/4817H01L21/486H01L24/81H01L24/85H01L2224/8121H01L2224/852
Inventor 冯光建丁祥祥陈雪平马飞程明芳郭丽丽郑赞赞郁发新
Owner 浙江集迈科微电子有限公司
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