LED flip chip integrated packaging structure and packaging method thereof

Abstract

The invention discloses an LED flip chip integrated packaging structure and a packaging method thereof. The structure comprises a rigid fluorescent layer, an LED flip chip and a circuit layer. One side of the rigid fluorescent layer is provided with a hole for accommodating the LED flip chip. The LED flip chip includes an illuminant and an electrode, the electrode is on a back surface of the illuminant, and the illuminant is placed in a hole of the rigid fluorescent layer. The circuit layer is disposed on a surface of the rigid fluorescent layer, and the circuit layer is coupled to the electrode of the LED flip chip. The invention provides the LED flip chip integrated packaging structure and the packaging method thereof, the problem of the large size of a terminal LED product can be solved, the problem of the difficult heat radiation of an existing packaging method can be solved, and the problem that a wafer and positive and negative electrodes of a substrate / bracket are connected by using gold wire in an existing packaging mode and the LED chip fails to work normally due to the easy breaking of the gold wires can be solved.

Description

technical field [0001] The invention relates to the field of LED flip-chip packaging, in particular to an LED flip-chip integrated packaging structure and a packaging method thereof. Background technique [0002] At present, the existing technology of LED packaging mostly adopts figure 1 The structure is packaged, that is, at least one LED chip b is installed on the substrate / support a, and the LED chip b is fixed on the placement area on the substrate or support a by a die-bonding glue, and then the LED chip b and the substrate / support a are connected with gold wires The positive and negative poles of the package are connected to the circuit, and then the LED chip b and the gold wire are wrapped with fluorescent glue c and silica gel d, and finally baked to remove the air bubbles in the encapsulation glue to achieve isolation from the air and prevent moisture. However, the use of these two packaging methods has the following disadvantages: [0003] 1. Use gold wire to con...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that the LED drive circuit cannot be integrated on the LED chip package in the prior art, resulting in a large volume of terminal LED products, a LED flip-chip integrated packaging structure is proposed. The invention provides an LED flip-chip integrated packaging structure that can Solve the problem of large volume of terminal LED products

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