Heat dissipation device and server

Abstract

The invention provides a heat dissipation device and a server. The heat dissipation device comprises a heat dissipation assembly and a bracket assembly, wherein the heat dissipation assembly is used for dissipating heat of a chip of the server and comprises a substrate and a heat dissipater, the heat dissipation assembly is connected with the bracket assembly through the substrate, the bracket assembly comprises a bracket and a plurality of first elastic structural parts arranged on the bracket, each first elastic structural part comprises a supporting part and a connecting part, and the connecting part is provided with at least one clamping hook. When the heat dissipation assembly and the bracket assembly are mounted, the clamping hooks are clamped with the heat dissipation assembly, so that the heat dissipation assembly is fixed; moreover, the supporting part generates upward buoyancy under the action of the gravity of the heat dissipation assembly so as to play a role in supportingthe heat dissipation assembly, so that the mounting and the dismounting are convenient; and meanwhile, the chip is prevented from being damaged in mounting, dismounting and dynamic load transportationscenes.

Description

Technical field [0001] This application relates to the field of servers, and in particular to a heat sink and a server. Background technique [0002] Under the torrent of the Internet, big data, and cloud computing, higher requirements are put forward for the transmission and processing speed, storage capacity, and high-performance computing capabilities of massive data. The server's chip generates a lot of heat during intensive calculations, and overheating of the chip will result in reduced processing capacity or even damage. [0003] In order to realize the heat dissipation of the chip, the chip and the heat sink are usually fixed by a clamping piece, and then the above structure is fixed on a printed circuit board (print circuit board, PCB) through a bracket. The clamping piece is used to limit the heat dissipation. The location of the device and the chip, the chip is mounted on the PCB through the chip socket. In order to prevent the chip and the heat sink from shifting duri...

AI Technical Summary

Problems solved by technology

Moreover, the chip is connected to the chip socket through the pins. During the installation and disassembly process, the above-mentioned fasteners generate greater pressure and easily cause the radiator to tilt, so that the pins of the chip are inserted into the chip socket. damage

In addition, the chip can also directly solder the pins to the PCB by welding. At this time, it is also necessary to use fasteners to abut the heat sink on the surface of the chip to dissipate heat. In the process of installing and removing the heat sink, the fasteners A large pressure can also easily cause the radiator to tilt, and then apply a large local instantaneous force to the chip, resulting in damage to the chip

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