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Thermoset polymer processing, healing and welding methods

A technology of polymer materials and processing methods, applied in the field of polymer materials, can solve problems such as high cost, limited application, and incompatibility of polymer systems, and achieve the effect of simple methods

Active Publication Date: 2020-07-03
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the light source has the advantages of local, remote, and in-situ control, it also requires special molecular design or the introduction of light-absorbing substances, which has problems of difficulty in dispersion and incompatibility with polymer systems. Some photoresponsive polymer materials are still Requires a special light source, which is not only expensive, but also very limited in application

Method used

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  • Thermoset polymer processing, healing and welding methods
  • Thermoset polymer processing, healing and welding methods
  • Thermoset polymer processing, healing and welding methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] The preparation of embodiment 1 thermosetting epoxy resin

[0077] Prepare a mixture of bisphenol A diglycidyl ether, adipic acid and transesterification catalyst 1,5,7-triazabicyclo[4.4.0]dec-5-ene (TBD) at a molar ratio of 1:1:0.1 ;

[0078] Melt the mixture at 180°C and stir to mix evenly;

[0079] Put the melted mixture in a mold, keep the temperature constant until the system begins to gel, then place the system under 5 MPa and heat press, and continue to solidify for 4 hours to completely react bisphenol A diglycidyl ether with adipic acid to obtain Thermosetting epoxy resin containing ester linkages. Wherein, the mold is a self-made mold with a square hole in the middle, which is used to prepare the thermosetting epoxy resin system into a square film. The mold can be an aluminum sheet with a thickness of 0.2mm. The prepared square film structure is used as the initial thermosetting epoxy resin material 10 .

Embodiment 2

[0080] Example 2 Healing of thermosetting epoxy resins

[0081] see figure 2 , prick the needle hole 21 or scratch on the surface of the initial thermosetting epoxy resin material prepared in Example 1 with a sharp instrument to produce a scratch 22;

[0082] Apply THF solvent on the corners to make the pinholes 21 and scratches 22 swell;

[0083] The THF solvent is volatilized, and the pinholes 21 and the scratches 22 are healed after the THF solvent is fully utilized, and a cured thermosetting epoxy resin material 31 is obtained.

[0084] After the above-mentioned healing, the thermosetting epoxy resin material 31 is warmed up to the glass transition temperature (T g ), such as above 80 ℃, the healing form remains unchanged.

Embodiment 3

[0085] The welding of embodiment 3 thermosetting epoxy resin

[0086] see image 3 , providing two initial thermosetting epoxy resin materials prepared in Example 1, i.e. the first initial thermosetting epoxy resin material 11 and the second initial thermosetting epoxy resin material 12;

[0087] Make the first welding part 23 and the second welding part 24 overlap and contact, and apply pressure to compress each other;

[0088] Apply THF solvent on the contact part to make the contact part swell;

[0089] The THF solvent is volatilized, and after the THF solvent is fully utilized, the first initial thermosetting epoxy resin material 11 and the second initial thermosetting epoxy resin material 12 are welded together to form an integrated welded thermosetting epoxy resin material 42 .

[0090] After the above-mentioned welding, the thermosetting epoxy resin material 42 is heated to the glass transition temperature (T g ), such as above 80 ℃, the welding part will not loosen....

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Abstract

The invention discloses a thermosetting high-molecular material processing method. The thermosetting high-molecular material processing method comprises following steps: a thermosetting high-molecularmaterial with parts to be processed is provided, wherein the parts to be processed possess cross-linked networks, and the cross-linked networks contain dynamic covalent bonds; a solvent is provided for swelling of the parts to be processed, so that after swelling of the parts to be processed with the solvent, dynamic covalent bond exchange at the parts to be processed is realized, and new cross-linked networks are formed; and the thermosetting high-molecular material is dried for fixing of the shape of the new cross-linked networks at the parts to be processed. The invention also discloses athermosetting high-molecular material healing method, and a thermosetting high-molecular material welding method.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a method for processing, healing and welding thermosetting polymer materials. Background technique [0002] Polymer materials can be simply divided into two types: thermosetting and thermoplastic. Thermoplastic polymers are linear polymers that can be reprocessed by heating, melting or solvent dissolution. Thermosetting polymer is a three-dimensional cross-linked network, which is insoluble and infusible. Once processed, it cannot be processed again. If the formed thermosetting polymer material is damaged or needs to be used after splicing, it will face the problem of needing to be processed again. [0003] At present, although the existing methods of external stimulation induction such as light, heat, and electricity can realize post-molding processing of polymer materials, the construction process using these methods is complicated, and the preparation process, stimulation mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/02C08J5/18C08J3/24C08L63/00C08G59/42C08G59/68
CPCC08G59/4207C08G59/686C08J3/246C08J5/18C08J7/02C08J2363/00C08J2463/00
Inventor 吉岩杨洋
Owner TSINGHUA UNIV
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