Vapor plate reinforced server heat dissipation device and method based on thermoelectric refrigeration technology

Abstract

The invention discloses a thermoelectric refrigeration technology-based high-efficiency cooling device and method of a soaking plate reinforcement server. The cooling device comprises a soaking platecold plate, a printed plate, an upper groove plate, a lower groove plate, a thermoelectric refrigeration sheet, an upper soaking heat sink, a lower soaking heat sink and an axial draught fan, whereinheat conduction bosses are arranged on the upper groove plate and the lower groove plate, the soaking plate cold plate is contacted with the heat conduction bosses of the upper groove plate and the lower groove plate by locking devices, the printed board is fixed on the soaking plate cold plate, heat of a heating component on the printed board is conducted to the bosses of the upper groove plate and the lower groove plate by the soaking plate cold plate, is conducted to the thermoelectric refrigeration sheet by the bosses of the upper groove plate and the lower groove plate and then is conducted to the upper soaking plate heat sink and the lower soaking plate heat sink by the thermoelectric refrigeration sheet, and heat of the heat sinks is taken away by pumping of the axial draught fan. Heat is dissipated by combining the soaking plate and thermoelectric refrigeration, a large amount of heat is dissipated, heat dissipate is stable, and moreover, damage to cooling equipment is reduced.

Description

technical field [0001] The invention belongs to the field of heat dissipation of servers reinforced against harsh environments, in particular to a high-efficiency heat dissipation device and method for servers reinforced with vapor chambers based on thermoelectric refrigeration technology. [0002] technical background [0003] With the rapid development of microelectronics technology and large-scale integrated circuit technology, while the performance of electronic equipment has been continuously improved, the power consumption and heat per unit volume of electronic equipment have also increased significantly. Forced air cooling technology is low in cost, high in reliability, and easy to implement. It is currently the most widely used heat dissipation technology in thermal control technology of electronic equipment. There is a certain gap in the application requirements of electronic equipment. Suppliers of reinforced electronic equipment at home and abroad generally improve...

AI Technical Summary

Problems solved by technology

[0005] Patent CN106102418B discloses a liquid-cooled VPX case high-efficiency heat dissipation device and method based on a vapor chamber. The cold plate in this technology adopts liquid-cooled heat dissipation technology. In terms of safety and reliability, existing water-cooled and heat-dissipating electronic equipment generally has shortcomings such as complex structure, large size, poor maintainability, low reliability, and weak environmental adaptability, which limits the application field and scope of water-cooled and heat-dissipating electronic equipment.

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