Production line and production process of printed circuit board for new energy automobile

Abstract

The invention discloses a production line of a printed circuit board for a new energy automobile; the production line comprises an etching device and a leveling device, wherein the etching device comprises a rack (1), a power unit, and a purging device and a spraying device arranged on the rack (1); the leveling device comprises a working table (51) and a driving mechanism; a bearing table (52) isarranged on the top of the working table (51); and an arched frame A (53) which is fixedly arranged above the bearing table (52) is arranged on the top of the working table (51). The production linehas the beneficial effects that the structure is compact, the labor intensity of workers is reduced, the production efficiency of the printed board for the new energy automobile is improved, the etching liquid is repeatedly used, the heat deformation of the circuit board is prevented, and the etching cost is saved.

Description

technical field [0001] The invention relates to the technical field of etching printed circuit boards of new energy vehicles, in particular to a production line and a production process of printed circuit boards for new energy vehicles. Background technique [0002] Printed circuit boards for new energy vehicles are an indispensable and important part of electronic equipment for new energy vehicles. The manufacturing process of printed circuit boards for new energy vehicles is to use circuit substrates as raw materials, and then go through the flattening process, pickling Process, etching process, etc.; the purpose of the flattening process is to flatten the unevenness on the surface of the printed circuit board for new energy vehicles, so as to ensure that the circuit layer is etched on the circuit substrate to make the product quality higher. The existing leveling methods mostly use manual operation, that is, lay it flat on the workbench first, then observe the unevenness ...

AI Technical Summary

Problems solved by technology

The existing leveling methods mostly use manual operation, that is, lay it flat on the workbench first, then observe the unevenness on the printed circuit board, and finally the worker hits the unevenness with a hammer. Although this operation method can Realize the leveling of the printed circuit board, but the operation process is relatively cumbersome, and most of them are carried out manually, which undoubtedly increases the labor intensity of the workers and reduces the leveling efficiency. Larger heat, the heat deforms the circuit board, thereby reducing product quality

The purpose of the etching process is to remove the unnecessary copper foil to obtain the required circuit diagram. Among them, spray etching is the most commonly used. It sucks the etching liquid into the nozzle by pressurization, and then sprays it on the surface of the circuit board. Etch away unnecessary copper foil. During etching, since a large amount of etching solution will remain on the surface of the etching solution, it will be washed away by clean water after etching, and this part of etching solution will not be fully utilized, resulting in waste of etching solution

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