Upside-down mounted LED chip and manufacturing method thereof

A technology of light-emitting diodes and chips, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as short circuits, reduce leakage risks, improve product reliability, and improve product yield.

Pending Publication Date: 2019-08-06
ELEC TECH PHOTOELECTRIC TECH DALIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to address the problem that cracks are prone to appear on the edge of the traditional flip-chip LED chip and cause the short circuit of the P electrode and the N electrode. Flip-chip light-emitting diode chip manufacturing method and flip-chip light-emitting diode chip with leakage risk

Method used

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  • Upside-down mounted LED chip and manufacturing method thereof
  • Upside-down mounted LED chip and manufacturing method thereof
  • Upside-down mounted LED chip and manufacturing method thereof

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Embodiment Construction

[0030] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail through the following embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

[0031] The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom"...

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Abstract

The invention provides an upside-down mounted LED chip and a manufacturing method thereof. N type metal electrode layers are arranged in the peripheral edges of the upside-down mounted LED chip, and aP type metal electrode layer is arranged in the middle part of the upside-down mounted LED chip. Even if solder paste is connected with P or N poles due to damage of an insulating layer in the edge of the upside-down mounted LED chip, the P type and N type metal electrode layers are avoided from short circuit and electric leakage failure. A light emitting layer, a P type semiconductor layer and the P type metal layer are arranged in the middle part of the upside-down mounted LED chip, so that a mesa step (quantum well) is far from the edge of the chip, and the problem that a traditional upside-down mounted LED chip has the risk of electric leakage due to tendency to short circuit of the P and N electrodes and lack of an isolated slot is solved. The leakage risk can be reduced effectively,the working reliability of products is improved, and the yield rate of the products is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a flip-chip light emitting diode chip and a manufacturing method of the flip-chip light emitting diode chip. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) is a semiconductor electronic component that can convert electricity into light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting. [0003] At pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38H01L33/20H01L33/10H01L33/00
CPCH01L33/007H01L33/10H01L33/20H01L33/385H01L2933/0016
Inventor 刘岩闫宝玉刘鑫鲁洋刘宇轩陈顺利
Owner ELEC TECH PHOTOELECTRIC TECH DALIAN
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