Heat dissipation structure, circuit board assembly and processing technology thereof

Abstract

Embodiments of the present invention provide a heat dissipation structure, a circuit board assembly and a processing technology thereof, and relate to the field of electronic technology. The heat dissipation structure includes a heat dissipation through hole and a heat dissipation element arranged on the printed circuit board. Wherein, the heat dissipation element passes through the heat dissipation through hole, and the part of the heat dissipation element passing through the heat dissipation through hole is used for connecting with the heat dissipation pad of the electronic device. The heat dissipation structure, the circuit board assembly and the processing technology provided by the embodiments of the present invention are connected to the heat dissipation pads of the electronic devices through the heat dissipation parts, and play a heat dissipation effect on the electronic devices, thereby replacing the heat dissipation method of the existing adhesive heat sink. In this way, the risk of dropping the adhesive radiator can be eliminated, and the heat dissipation effect can be ensured, and the reliability is higher.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a heat dissipation structure, a circuit board assembly and a processing technology thereof. Background technique [0002] With the increasing integration of current chips, the energy consumption of chips is gradually increasing. At present, designers often use adhesive heat sinks on the front of electronic devices to meet heat dissipation requirements. For example, an adhesive heat sink is mounted on the front side of a quad flat no-lead package (Quad Flat No-lead Package, QFN) or a square flat package (Plastic Quad Flat Package, QFP) to meet heat dissipation requirements. However, the whole assembly process of the adhesive radiator is manually operated, and the assembly process has strict requirements on the operation time and the adhesive area. Once the specification requirements are not met, it is easy to cause incomplete curing of the colloid and a decrease in the adhesi...

AI Technical Summary

Problems solved by technology

However, the whole process of assembling the adhesive heat sink is manually operated, and the assembly process has strict requirements on the operation time and the adhesive area. Once the specification requirements are not met, it is easy to cause incomplete curing of the colloid and a decrease in the adhesive force; after the product has been used for a period of time , it is easy to cause the adhesive radiator to fall, causing the device chip temperature to be too high to work

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