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A high-precision packaging equipment for transistors

A technology for packaging equipment and transistors, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of long pruning time, single function, cumbersome operation, etc., and achieve high production efficiency, simple device operation, and high degree of automation Effect

Active Publication Date: 2020-11-03
深圳市克拉尼声学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As we all know, a transistor is a solid semiconductor device with multiple functions such as wave detection, rectification, and voltage stabilization. Generally, when a transistor is used, it needs to use soldering to package the pins of the transistor to the circuit board. Because it needs to be adapted to circuit boards of different specifications, The pins of transistors will be kept as long as possible during production to ensure that they can adapt to a variety of circuit boards; traditional transistor packages are manually spot-welded, and then the excess pins are manually cut off. This method is time-consuming and laborious, and is only suitable for small-scale production. After cutting the pins will still be exposed and cut the wrist. In addition, the pin cutting equipment on the market has a single function. After spot welding is required during the pin cutting process, the solder joints are melted and the excess pins are cut off while smoothing the plane of the solder joints. cumbersome, long pruning time, and low efficiency; therefore, it is necessary to design a transistor high-precision packaging equipment to solve the above problems

Method used

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  • A high-precision packaging equipment for transistors
  • A high-precision packaging equipment for transistors
  • A high-precision packaging equipment for transistors

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Embodiment Construction

[0023] Combine below Figure 1-5 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0024] combined with Figure 1-5 The described high-precision packaging equipment for transistors includes a box body 10, a working chamber 12 with an opening to the right is provided in the box body 10, and the top wall of the working chamber 12 is provided with a tin liquid that can be squeezed out and the transistor tin The extruding tin liquid mechanism 90 welded on the circuit board, a shaft sleeve 11 is arranged in the rotation of the working chamber 12, a cylindrical block 62 is fixed in the shaft sleeve 11, and a cylindrical block 62 is provided in the left end wall. There is a reversing mechanism 94 capable of reversing the cylindrical block 62;

[0025] The bottom wall of th...

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Abstract

The invention discloses transistor high-precision packaging equipment. The equipment comprises a box body, and a working cavity with a rightward opening is formed in the box body. The top wall of theworking cavity is provided with a tin liquid extruding mechanism capable of extruding tin liquid and soldering a transistor on a circuit board; a shaft sleeve is rotationally arranged in the working cavity; a cylindrical block is fixedly arranged in the shaft sleeve; a reversing mechanism capable of reversing the cylindrical block is arranged in the end wall of the left side of the cylindrical block. The invention has the following beneficial effects that when the equipment is used for packaging, a packaged object is accurately judged, so the mistaken packaging, specification errors or circuitboards without transistors are avoided; the equipment is safe and reliable, and can carry out the tin soldering when performing the shearing of the redundant pins; the equipment is flat in trimming and firm in welding spot connection; in the whole production process, the equipment is easy to operate and high in automation degree; in addition, the equipment can conduct packaging in a circulating and reciprocating mode, and the production efficiency of the device is high.

Description

technical field [0001] The invention relates to high-precision packaging equipment for transistors, and mainly relates to the field of semiconductor devices. Background technique [0002] As we all know, a transistor is a solid semiconductor device with multiple functions such as wave detection, rectification, and voltage stabilization. Generally, when a transistor is used, it needs to use soldering to package the pins of the transistor to the circuit board. Because it needs to be adapted to circuit boards of different specifications, The pins of transistors will be kept as long as possible during production to ensure that they can adapt to a variety of circuit boards; traditional transistor packages are manually spot-welded, and then the excess pins are manually cut off. This method is time-consuming and laborious, and is only suitable for small-scale production. After cutting the stitches will still be exposed and cut the wrist. In addition, the foot cutting equipment on t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/67
CPCH01L21/4896H01L21/67144H01L21/67253
Inventor 吴美娟何雁波吴颖华朱晓燕
Owner 深圳市克拉尼声学科技有限公司